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Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold

    Buy cheap Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold from wholesalers
     
    Buy cheap Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold from wholesalers
    • Buy cheap Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold from wholesalers
    • Buy cheap Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold from wholesalers
    • Buy cheap Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold from wholesalers

    Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold

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    Brand Name : Bicheng
    Model Number : BIC-2.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    Rogers 4350 Dual Layer 6.6 Mil High Frequency PCB With Immersion Gold

    Rogers 4350 Dual layer 6.6 mil High frequency PCB with Immersion Gold


    The qualities required by designers of RF microwave circuits, matching networks, and controlled impedance transmission lines are present in the material RO4350B. Since standard circuit board materials cannot be used in many applications due to higher operating frequencies, low dielectric loss makes it possible to employ RO4350B material in these applications.


    The dielectric constant is consistent across a wide frequency range and has one of the lowest temperature coefficients of any circuit board material.


    Main applications:

    Low Noise Block

    Power amplifiers

    RFID


    RO4350B Typical Value
    PropertyRO4350BDirectionUnitsConditionTest Method
    Dielectric Constant,εProcess3.48±0.05Z10 GHz/23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign3.66Z8 to 40 GHzDifferential Phase Length Method
    Dissipation Factortan,δ0.0037
    0.0031
    Z10 GHz/23℃
    2.5 GHz/23℃
    IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε+50Zppm/℃-50℃to 150℃IPC-TM-650 2.5.5.5
    Volume Resistivity1.2 x 1010MΩ.cmCOND AIPC-TM-650 2.5.17.1
    Surface Resistivity5.7 x109COND AIPC-TM-650 2.5.17.1
    Electrical Strength31.2(780)ZKv/mm(v/mil)0.51mm(0.020")IPC-TM-650 2.5.6.2
    Tensile Modulus16,767(2,432)
    14,153(2,053)
    X
    Y
    MPa(ksi)RTASTM D 638
    Tensile Strength203(29.5)
    130(18.9)
    X
    Y
    MPa(ksi)RTASTM D 638
    Flexural Strength255
    (37)
    MPa
    (kpsi)
    IPC-TM-650 2.4.4
    Dimensional Stability<0.5X,Ymm/m
    (mil/inch)
    after etch+E2/150℃IPC-TM-650 2.4.39A
    Coefficient of Thermal Expansion10
    12
    32
    X
    Y
    Z
    ppm/℃-55℃to288℃IPC-TM-650 2.4.41
    Tg>280℃ TMAAIPC-TM-650 2.4.24.3
    Td390℃ TGAASTM D 3850
    Thermal Conductivity0.69W/M/oK80℃ASTM C518
    Moisture Absorption0.06%48hrs immersion 0.060"
    sample Temperature 50℃
    ASTM D 570
    Density1.86gm/cm323℃ASTM D 792
    Copper Peel Stength0.88
    (5.0)
    N/mm
    (pli)
    after solder float 1 oz.
    EDC Foil
    IPC-TM-650 2.4.8
    Flammability(3)V-0UL 94
    Lead-free Process CompatibleYes


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