ABS 2 Inch Waffle Pack Chip Tray For Tiny Electronic Chip
The Waffle pack is an ideal tray for storing and transporting tiny
electronic components because of its permanent anti-static
properties. At the same time, it also has good mechanical strength
and heat resistance, which will not be affected by the environment,
time and temperature.
Because the product is prone to friction during storage and
transportation, the ABS chip tray can effectively release the
static charge accumulated on the surface of the object. If the
packaging does not have anti-static properties, the product quality
may be affected during transportation and even been damaged.
Details about The HN21118 Waffle Pack
The HN21118 waffle pack is tray made of industrial plastic ABS. It
has a variety of excellent properties, such as good dimensional
stability, heat resistance, low temperature resistance and
excellent anti-static electrical properties. In addition, the
resistance to chemical corrosion is also very strong, which makes
it a very widely used industrial plastics.
The waffle pack is small in size,light in weight, suitable for
transferring or loading, samples for testing. The matrix 10*20 can
hold more products and saves the transportation cost.It is the best
choice for customers to transport and store their products.
| Outline Line Size | 50.7*50.7*4mm | Brand | Hiner-pack |
| Model | HN21118 | Package Type | Die |
| Cavity Size | 2.8*1.0*0.3 | Matrix QTY | 10*20=200PCS |
| Material | ABS | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
Application of the HN21118 Black 2 inch Chip Tray
Electronic Components Semiconductor
Embedded System Micro and Anon System
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products |
Advantages
1. Light weight, saving transportation and packaging costs;
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack
Feeder Machine;
3. Good anti-static performance, effectively ensure that the
product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature
automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production
conditions of products;
6. Matrix arrangement design, under the premise of protecting the
product, the maximum capacity design, cost saving;
7. Edge chamfer design, effectively prevent stacking error, correct
the direction of placement.
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as
possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whats app, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear
description of the IC or component.Provide one-stop service from
design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one
which is the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products
comply with the international JEDEC standards, to ensure 100%
qualified rate.
