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Conformal Coating PCB Fabrication High Multilayer Rigid Flex Pcb

    Buy cheap Conformal Coating PCB Fabrication High Multilayer Rigid Flex Pcb from wholesalers
     
    Buy cheap Conformal Coating PCB Fabrication High Multilayer Rigid Flex Pcb from wholesalers
    • Buy cheap Conformal Coating PCB Fabrication High Multilayer Rigid Flex Pcb from wholesalers

    Conformal Coating PCB Fabrication High Multilayer Rigid Flex Pcb

    Ask Lasest Price
    Price : Negotiable
    Payment Terms : T/T
    Supply Ability : 100000pc/Month
    Delivery Time : 4 Weeks
    Brand Name : CUSTOM MADE
    Certification : ISO/UL
    • Product Details
    • Company Profile

    Conformal Coating PCB Fabrication High Multilayer Rigid Flex Pcb

    Conformal Coating Printed Circuit Board Fabrication High Multilayer

    Printed Circuit Board Fabrication Description:
    1. Quick-turn and flexible delivery.
    2. Support a wide range of PCBs: high-layer, multi-layer, rigid-flex, high frequency, high speed, etc.
    3. Professional supplier positioning.
    4. Seamless link from prototype to mass production.
    5. Whole-flow quality assurance, IPC, Special industry inspection standard.

    Printed Circuit Board Fabrication Parameters:

    ItemTechnical Parameter
    Layer2-64
    Thickness0.3-6.5mm
    Copper Thickness0.3-12 oz
    Min Mechanical Hole0.1mm
    Min Laser Hole0.075mm
    HDI1+n+1,2+n+2,3+n+3
    Max Aspect Ratio20:01
    Max Board Size650mm*1130mm
    Min Width/Space2.4/2.4mil
    Min Outline Tolerance±0.1mm
    Impedance Tolerance±5%
    Min PP Thickness0.06mm
    Bow &Twist≤0.5%
    MaterialsFR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872
    Surface FinishedHASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
    Special CapabilityGold Finger Plating, Peelable, Carbon ink


    Printed Circuit Board Fabrication Introduction:
    The earliest use of printed circuit boards is paper-based copper-clad printed boards. Since the advent of semiconductor transistors in the 1950s, the demand for printed boards has risen sharply. Especially with the rapid development and wide application of integrated circuits, the volume of electronic equipment is getting smaller and smaller, and the circuit wiring density and difficulty are getting bigger and bigger, which requires the printed board to be updated continuously. At present, the variety of printed boards has developed from single-sided to double-sided, multi-layer boards and flexible boards; the structure and quality have also developed to ultra-high density, miniaturization, and high reliability.

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