Immersion Gold + OSP Electronic Component Sourcing 0.5 - 17.5mm
Thickness Nelco
Electronic Component Sourcing Description:
The PCB assembly we produce includes rapid turn prototype PCB
assembly, SMT/SMD assembly, through-hole assembly, hybrid
technology (SMT/through-hole), turnkey assembly, consignment
assembly, etc. They are widely used in industrial control, medical
care, automotive electronics, communications, and the Internet.
SMT, post welding, assembly to testing one-stop service supports
flexible supply.
PCB Manufacturing Parameters:
| Item | Technical Parameter |
| Layer | 2-64 |
| Thickness | 0.3-6.5mm |
| Copper Thickness | 0.3-12 oz |
| Min Mechanical Hole | 0.1mm |
| Min Laser Hole | 0.075mm |
| HDI | 1+n+1,2+n+2,3+n+3 |
| Max Aspect Ratio | 20:01 |
| Max Board Size | 650mm*1130mm |
| Min Width/Space | 2.4/2.4mil |
| Min Outline Tolerance | ±0.1mm |
| Impedance Tolerance | ±5% |
| Min PP Thickness | 0.06mm |
| Bow &Twist | ≤0.5% |
| Materials | FR4, High-Tg FR4, Rogers, Nelco, RCC, PTFE, M4, M6, TU862, TU872 |
| Surface Finished | HASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion
Gold+OSP |
| Special Capability | Gold Finger Plating, Peelable, Carbon ink |
Electronic Component Sourcing Introduction:
All of the components we buy are from original manufacturers or
A-level dealers, which means that we will never use old parts,
updated parts or parts with old date codes. Full process quality
assurance, IPC, and special industry inspection standards.
