Oem Assembly Pcb Assembly Smt Circuit Board
A well designed circuit board means:
· A reduction in production problems
· Improved quality control
· Reduced costs
· Reduced manufacturing times
1 . Descriptions:
What is a HDI PCB?
HDI stands for High Density Interconnector. A circuit board which
has a higher wiring density per unit area as opposed to
conventional board is called as HDI PCB. HDI PCBs have finer spaces
and lines, minor vias and capture pads and higher connection pad
density. It is helpful in enhancing electrical performance and
reduction in weight and size of the equipment. HDI PCB is the
better option for high-layer count and costly laminated boards.
Regarding the electrical needs of high-speed signal, the board
should have various features i.e. high-frequency transmission
capability, impedance control, decreases redundant radiation, etc.
The board should be enhanced in the density because of the
miniaturization and arrays of the electronic parts. In addition, to
the result of the assembling techniques of leadless, fine pitch
package and direct chip bonding, the board is even featured with
exceptional high-density.
Innumerable benefits are associated with HDI PCB, like high speed,
small size and high frequency. It is the primary part of portable
computers, personal computers, and mobile phones. Currently, HDI
PCB is extensively used in other end user products i.e. as MP3
players and game consoles, etc.
2 . Specifications:
| Item | Specification | |
| 1 | Numbr of Layer | 1-18Layers |
| 2 | Material | FR-4,FR2.Taconic,Rogers, CEM-1 CEM-3,ceramic , crockery
Metal-backed Laminate |
|
| 3 | Surface Finish | HASL(LF), Gold plating, Electroless nickel immersion gold,
Immersion Tin, OSP(Entek) |
| 4 | Finish Board Thickness | 0.2mm-6.00 mm(8mil-126mil) |
| 5 | Copper Thickness | 1/2 oz min;12 oz max |
| 6 | Solder Mask | Green/Black/White/Red/Blue/Yellow |
| 7 | Min.Trace Width & Line Spacing | 0.075mm/0.1mm(3mil/4mil) |
| 8 | Min.Hole Diameter for CNC Driling | 0.1mm(4mil) |
| 9 | Min.Hole Diameter for punching | 0.9mm(35mil) |
| 10 | Biggest panel size | 610mm*508mm |
| 11 | Hole Positon | +/-0.075mm(3mil) CNC Driling |
| 12 | Conductor Width(W) | 0.05mm(2mil)or; +/-20% of original artwork |
| 13 | Hole Diameter(H) | PTH L:+/-0.075mm(3mil); Non-PTH L:+/-0.05mm(2mil) |
| 14 | Outline Tolerance | 0.125mm(5mil) CNC Routing; +/-0.15mm(6mil) by Punching |
| 15 | Warp & Twist | 0.70% |
| 16 | Insulation Resistance | 10Kohm-20Mohm |
| 17 | Conductivity | <50ohm |
| 18 | Test Voltage | 10-300V |
| 19 | Panel Size | 110×100mm(min);660×600mm(max) |
| 20 | Layer-layer misregistration | 4 layers:0.15mm(6mil)max; 6 layers:0.25mm(10mil)max |
| 21 | Min.spacing between hole edge to circuity pqttern of an inner layer | 0.25mm(10mil) |
| 22 | Min.spacing between board oulineto circuitry pattern of an inner
layer | 0.25mm(10mil) |
| 23 | Board thickness tolerance | 4 layers:+/-0.13mm(5mil); 6 layers:+/-0.15mm(6mil) |
| 24 | Impedance Control | +/-10% |
| 25 | Different Impendance | +-/10% |
3. Advantages:
The most common reason for using HDI technology is a significant
increase in packaging density. The space obtained by finer track
structures is available for components. Besides, overall space
requirements are reduced will result in smaller board sizes and
fewer layers.
Usually FPGA or BGA are available with 1mm or less spacing. HDI
technology makes routing and connection easy, especially when
routing between pins.
