Technical advantages of automatic solder paste printing machine
1: Customized system solutions to meet individual needs, flexible
options for various production applications.
2: Professional-grade high-quality mechanical design,
professional-grade 03015 (metric) solder paste printing process
support, 14 years of high-quality machinery manufacturing
experience.
3. Easy to operate, minimize downtime for line change. Minimal
maintenance requirements and maintenance costs.
4. Use intelligent software tools for process monitoring and
tracking at any time.
YSL technical training advantages
1. Provide expertise in system design, operation and process flow
2. Professionals to help you improve production efficiency
3. Comprehensive training plan
4. Personality training and workshops
5. Internal training
Automatic solder paste printing machine Function introduction
1. CCD digital camera system:
Brand-new optical path system (1.3 million digital camera)--uniform
ring light and high-brightness coaxial light, together with
infinitely adjustable brightness function, make all types of Mark
points can be well identified (including unevenness Mark point),
suitable for tin-plated, copper-plated, gold-plated, tin-sprayed,
FPC and other types of PCBs with different colors.
2.Rail positioning system
National utility model invention patent Patent No. (ZL
2005100371991.6), detachable, programmable flexible side clip
device, for flexible boards, warped PCBs, and unique top
flattening.
Through software programming, it can be automatically stretched
without affecting the tin thickness.
3. Brand new scraper structure design
Through the new scraper structure of the slide rail and the
cylinder, the operation stability is improved and the service life
is prolonged.
4. Steel mesh detection system
By compensating the light source above the stencil, and using CCD
to check the mesh of the stencil in real time, it can quickly
detect and judge whether the stencil is blocked after cleaning, and
perform automatic cleaning, which is a 2D detection of the PCB
board. kind of supplement.
5. Bottle type automatic tinning and automatic solder paste
detection function
Automatically add solder paste at regular and fixed points to
ensure the quality of solder paste and the amount of solder paste
in the stencil. So as to ensure the printing quality of customers
and improve productivity.
The sensor manages the amount of solder paste on the stencil,
enabling stable quality and long-term continuous printing. Improve
productivity
6. Solder paste rolling detection function
1. The stencil solder paste thickness detection system is mainly
composed of a laser distance sensor installed behind the squeegee
beam.
2. The working principle is mainly that before the machine leaves
the factory, we will set the distance from the laser to the sensor.
When the diameter of the rolling solder paste is less than ф12mm,
the software will alarm and prompt whether to add solder paste or
continue production. If the machine simultaneously Configured with
automatic tinning function, then when the amount of tin is less
than the set value, it will automatically add solder paste (as
shown above).
3. The laser distance sensor adopts the built-in CMOS laser sensor
of Keyence's amplifier. It adopts a stainless steel casing, which
has excellent visibility and is easy to operate. It only needs to
press three times to complete the setting, and anyone can easily do
it. Adjustments and settings.
7.Bottle type automatic tinning and automatic solder paste
detection function
Automatically add solder paste at regular and fixed points to
ensure the quality of solder paste and the amount of solder paste
in the stencil. So as to ensure the printing quality of customers
and improve productivity.
The sensor manages the amount of solder paste on the stencil,
enabling stable quality and long-term continuous printing. Improve
productivity
8. New multifunctional interface
concise. Easy to operate. Real-time temperature and humidity
monitoring function
9.All screw rods and slider guides of the machine are produced with
original foreign products, and imported to ensure accuracy and
stability
10. Leading Industry 4.0 Compatibility
Through the automatic upload or output of machine status and
parameters, it provides a strong guarantee for customers' Industry
4.0 intelligent production. It can realize the seamless connection
with the customer's MES system and achieve high product
traceability; intelligent management and control of equipment
maintenance.
According to the realization of on-site management, the use rights
of engineering personnel at all levels are allocated by themselves.
Automatic solder paste printing machine parameters
| Substrate processing | |
| Maximum substrate size (XxY) | 450*340mm |
| Minimum substrate size (XxY) | 50*50mm |
| Substrate thickness dimension | 0.4~6mm |
| Maximum substrate weight | 3Kg |
| Substrate edge clearance | 2.5mm |
| Overboard height | 17mm |
| Transmission height | 900 ± 40mm |
| Transfer speed | 1500mm/s(Max) |
| Transfer method | One-section transport rail |
| Substrate clamping | Automatic retractable upper tablet |
| Flexible side clip |
| Vacuum suction |
| Printing parameters | |
| Maximum printing area (XxY) | 450*340mm |
| Printing release (Snap-off) | 0-20mm |
| printing mode | Single or double doctor blade printing |
| Scraper type | Rubber scraper/steel scraper (angle 45/55/60) |
| Printing speed | 6~200mm/sec |
| Printing pressure | 0.5~10Kg |
| Template frame size | 370*370mm~737*737mm |
| Cleaning method | Enhanced vacuum adsorption |
| Dry, wet, vacuum three modes |
| Cleaning back and forth |
| Substrate Support Method | Magnetic Thimble |
| Contour block |
| Manually adjust the jacking platform |
| Image | |
| Image Field of View (FOV) | 8*6mm |
| Datum point type | Standard shape reference point |
| Pad |
| Hole |
| Camera system | Vision system for top/bottom imaging |
| Digital camera |
| Geometry match positioning |
| Performance | |
| System alignment accuracy and repeatability | ±12.5 microns@6σ,Cpk≥2.0 |
| Actual solder paste placement repeatability | ±18 microns@6σ,Cpk≥2.0 |
| Repeat accuracy of actual solder paste printing position based on
third-party test system (CTQ, Germany) verification | |
| Printing cycle | <7.5 sec (excluding printing and cleaning time) |
| Equipment | |
| Power requirements | AC: 220±10%, 50/60HZ, 2.5KW |
| Compressed Air Requirements | 4~6 Kgf/cm2 |
| Air consumption | About 5L/min |
| Working temperature | -20℃~+45℃ |
| Working environment humidity | 30%~60% |
| Machine height (remove tri-color light) | 1510(H)mm |
| Machine length | 1156(L)mm |
| Machine width | 1400(W)mm |
| Machine weight | Approx: about 1000Kg |
Why choose YSL?
Dongguan Yushunli Automation Equipment Co., Ltd. (YSL) can provide
the most professional solder paste printing solution system for the
electronic manufacturing industry (SMT). As a high-end quality
automatic solder paste printing machine manufacturer, it has always
led the trend of technological innovation in the assembly and
production of electronic components. For a long time, YSL has won
the trust of countless "heavyweight" customers in the fields of
automotive electronics, medical technology, aerospace technology,
industrial electronics and military industry with its excellent
quality.
Technology is our passion. YSL pursues excellent product quality
and is also committed to providing excellent customer service. From
China to Europe, or from Singapore to the United States - we aim to
perfect all sales and service networks. Dedicated to provide you
with professional support covering the world! Do you have any
special inquiries about YSL's printing system, assembly or process?
Our responsibility does not stop at sales, after purchasing YSL
equipment, we will keep the closest contact with you and respond to
all your needs quickly and promptly. We will do our best to ensure
on-time delivery and perform installation and maintenance services
of the highest standard. In addition, our experts are at your
service 24 hours a day, ready to provide you with application
support to keep production running smoothly.
