350um Fused Silica Wafer Quartz Borosilicate Glass Carrier Wafers

Fused Silica Quartz Borosilicate Glass Wafer As Carrier Wafers

Due to their low thickness, thin wafers are vulnerable to stress and breakage. Warping of the wafers during handling and processing causes a high yield loss or can even make it impossible to handle the wafers any more. This means that a thin wafer handling technology with a high degree of flexibility on wafer and substrate sizes is needed. Carrier wafers need to have certain properties, such as: mechanical robustness; chemical and high-temperature resistance; incredibly low tolerances (down to 1 μm thickness variation); and thermal expansion adjusted to the used material, for example, gallium arsenide (GaAs), Indium phosphide (InP), silicon (Si) or silicon carbide (SiC). Furthermore, handling tools sometimes need to be suitable for materials such as GaAs and Si, or even CMOS compatible.

High-end carrier wafers made of glass, quartz or silicon can meet the aforementioned requirements. Glass and quartz are excellent materials for carrier wafers because of their thermal stability and resistance against acids and other chemicals. Bonding to and de-bonding from glass and quartz carrier wafers can be monitored since they are transparent. Furthermore, glass carrier wafers can be cleaned and re-used, thus contributing to cost reduction and environmental protection.

BonTek works on a variety of glass and quartz materials, Fused Silica (JGS1, JGS2, JGS3, Corning 7980), Eagle XG, Schott BF33, Pyrex, MEMpax, B270, D263T, Zerodur etc.

Acceptance Check

• The product is fragile. We have adequately packed it and labeled it fragile. We deliver through excellent domestic and international express companies to ensure transportation quality.

• After receiving the goods, please handle with care and check whether the outer carton is in good condition. Carefully open the outer carton and check whether the packing boxes are in alignment. Take a picture before you take them out.

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• Please open the vacuum package in a clean room when the products are to be applied.

• If the products are found damaged during courier, please take a picture or record a video immediately. DO NOT take the damaged products out of the packaging box! Contact us immediately and we will solve the problem well.

Founded in 1999, Hangzhou Freqcontrol Electronic Technology Ltd. is a China leading manufacturer of piezoelectric crystal wafers, substrates, components and single crystal growth. We, known as the "CQT Group" in global market, headquartered in Hangzhou, China, empowered by its manufacturing sites in Shanghai, Jiaxing and Deqin etc.

Our products are mainly used in RF Telecom, Semiconductor, Biotech, Optical engineering and frequency control industries. The monthly production capacity: 500K single quartz blanks (SC, AT, IT, FC, etc.), 20K quartz wafers (AT, ST, X, Z, etc.), 10K LiNbO3 wafers (3~8 inch), 10K glass wafers (Fused silica, Borofloat33, Corning, etc.), 8K LiTaO3 wafers (3~6 inch), and 100K filters/oscillators (VCXO, TCXO).

Our company vision is to be a reliable primary Microelectronic substrates supplier in today's world.

The CQT Group consists of five major plants with total floor area over 10,000 m². Our production machines include crystal growth furnace, wire saw, X-ray orientation, grinding machine, polishing machine, chamfering machine, CNC, REDOX chambers etc. Inspection equipment include Flatmaster 200, AOI, profilometer, optical imager, X-ray inspector etc. We are also equipped with Class 100 and 1000 clean rooms.

The CQT group is primarily known as the expert of hexagonal crystals, We master the manufacturing process of single & doubly rotated quartz blanks, and we can provide quartz of any orientation cut whether given by IRE , Miller index, Euler angle or conventional sign.

In addition to our leading quartz blank manufacturing capabilities, the last decade sees our major technological breakthroughs. We overcome the 3~6 inch ultra-thin wafer mass production barrier, obtained the reduction technology of black LiNbO3 & LiTaO3 wafers, and achieved 8 inch LiNbO3 wafer mass production successfully.

Competitive Advantages

1. Reliable partner: We are in this business for over 30 years, served over 200 customers in 20+ countries.
2. Complete production line: We do crystal orientation, wire cut, grinding, polishing, etching, flat/notch, surface inspecting, x-ray detecting etc. all in house!
3. State-of-the-art cleanroom: We have 3 Class1000 clean room, 1 Class100 work desk, complete wafer cleaning & drying process.
4. Efficient customer service: Prompt RFQ response & Order confirmation in 24 hrs, customization lead time in 4 weeks.