ABS Black 4 Inch Waffle Pack for Micro IC Chips
The ABS Waffle Pack is an ideal tray for storing tiny ic chip,
which has permanent anti-static performance. In the process of
using, it has good mechanical strength and heat resistance.
Meanwhile, the product has good impact strength and chemical
corrosion resistance, and will not be affected by the environment,
time and temperature to change its ESD performance.
1.Details about the HN21097 ABS Black 4 Inch Waffle Pack for Micro
IC Chips
Because the IC chip is prone to friction during storage and
transportation, the quality of the product may be affected or even
damaged if the ESD property is not available. Customers can use the
HN21097 Waffle pack made of ABS to store electronic components or
ic chips, which can effectively avoid short circuit.
The waffle pack can effectively release the static charge
accumulated on the surface of the object, so that it will not
produce large charge and high potential difference. Therefore, it
can lower the damage rate of the product in the production process
and transportation, reducing the cost of the product and improve
the quality and profit.
| Outline Line Size | 101.6*101.6*9mm | Brand | Hiner-pack |
| Model | HN21097 | Package Type | Die |
| Cavity Size | 4.35*5.45*2.5 | Matrix QTY | 10*14=140PCS |
| Material | ABS | Flatness | MAX 0.3mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
2.Our Service
1. We have sample stock, also can help the client to choose which
type is suitable for them.
2. We will reply you in any time if you have questions.
3. Choose suitable product for clients according to clients'
requirement.
4. After mold customization, free samples will be provided until
the customer tests OK, so as to remove the mass production quality
concerns of customers before quantity.
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized |
3.Advantages
1. Suitable for components or devices daily turnover or
long-distance freight.
2. Can be stacked more layers.
3. Can be washed at high temperature.
4. Plastic waterproof, moisture-proof, improve the storage time of
components.
5. No extrusion and breakage, Better protection components.
6. Reusable, quality assurance.
4.FAQ
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years
with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you
according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we
can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee
should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly
please.
