ELKONITE 10W3 W75Cu25 Tungsten Copper Alloy Machined parts with
density of 14.8g/cm3
Tungsten Copper Alloy types,chemical compositions and main
properties:
| Grade | Density: g/cm3 | Tensile Strength/Mpa | Hardness (HB) | Conductivity %IACS | Main Applications |
| Room Temperature | 1600℃ |
| WCu7 | 17.3~17.8 | 400~750 | 50~120 | 280 | ≥26 | Nozzle, gas rudder |
| WCu10 | 16.8~17.3 | 400~700 | 60~100 | 260 | ≥27 | Nozzle, gas rudder |
| WCu15 | 16.0~16.5 | 300~600 | / | 240 | ≥30 | component, barium salt electronic cathode |
| WCu20 | 15.1~15.5 | / | / | 220 | ≥34 | Contact, electrode |
| WCu30 | 13.7~14.2 | / | / | 175 | ≥42 | Contact, electrode |
| WCu40 | 12.7~13.2 | / | / | 140 | ≥47 | Contact, electrode |
| WCu50 | 11.7~12.2 | / | / | 115 | ≥55 | Contact, electrode |
No arc erosion: With the right mix of materials.
| |
By choosing the right mixture of tungsten and copper, we are able
to influence the product's arc erosion properties. At a tungsten
content of 80 %, we achieve the lowest arc erosion rates. Depending
on the voltage and current intensity as well as on economic
considerations, we can vary the tungsten content between 60 and 90
% to meet the exact needs of your application. |
Tungsten copper alloy is a composite metal of tungsten and copper,
which combines many excellent characteristics of tungsten and
copper. Among them, tungsten has high melting point (tungsten
melting point is 3410 ℃, copper melting point is 1083 ℃) and high
density (tungsten density is 19.34g/cm3, copper density is
8.92g/cm3); Copper has excellent electrical and thermal
conductivity. Tungsten copper alloy (composition generally ranges
from WCu7 to WCu50) has uniform microstructure, high temperature
resistance, high strength, arc erosion resistance and high density;
With moderate conductivity and thermal conductivity, it is widely
used as military high-temperature resistant materials, electrical
alloys for high-voltage switches, EDM electrodes and
microelectronic materials. As parts and components, tungsten copper
alloy is widely used in aerospace, aviation, electronics, electric
power, metallurgy, machinery, sports equipment and other
industries.
Tungsten and copper materials are also widely used in semiconductor
materials because of their high heat resistance, good thermal
conductivity and conductivity, and the thermal expansion
coefficient matching with silicon wafers, gallium arsenide and
ceramic materials. Suitable for packaging materials, heat sink
materials, heat sink components, ceramics and gallium arsenide
base, etc.
It can be seen from the metallographic diagram that our tungsten
copper alloy material is very dense,
and far less than the allowable gap of national standard.No
internal holes.
Our dedicated tungsten copper for heat sink does not add third
party metal elements to activate sintering, so it has high thermal
conductivity.One of the advantages of tungsten-copper alloy used in
electronic packaging is that the thermal conductivity coefficient
of various materials such as gallium arsenide (GaAs) or ceramic
materials can be well matched by adjusting the formula.
As a tungsten-copper manufacturer, our company can adjust the
material formula according to the requirements of customers to meet
different thermal conductivity requirements.
WCu Alloy Finished Machining components as per drawing is available
and welcome your inquiry.
