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Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

    Buy cheap Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking from wholesalers
     
    Buy cheap Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking from wholesalers
    • Buy cheap Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking from wholesalers
    • Buy cheap Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking from wholesalers

    Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

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    Brand Name : AOK
    Model Number : TP800
    Certification : RoHS, Reach, UL
    Payment Terms : T/T
    Delivery Time : 13-15 working days
    • Product Details
    • Company Profile

    Tasteless IC Thermal Pad Material Low Thermal Resistance For Networking

    Low Thermal Resistance 8 W/m.K Pink Silicone Thermal Pad Material For Networking

    AttributeValueTest Method
    CompositionCeramic Filler + Silicone-
    ColorPinkVisual
    Thickness(mm)0.5~10astm d374
    Density(g/cc)3.35ASTM D792
    Hardness(shore oo)55±10ASTM D2240
    Usage Temperature(℃)-40~150--
    Electrical
    Breakdown Voltage(kv/mm)>6.0ASTM D149
    Dielectric Constant(@10mhz)7.2ASTM D150
    Volume Resistivity(Ω.cm)1012ASTM D257
    FlammabilityV-0UL94
    Thermal
    Thermal conductivity(W/m.K)8.0±0.5ASTM D5470

    Product feature
    ■ Thermal conductivity:8.0W/m.K
    ■ High thermal conductivity
    ■ Low oil permeability
    ■ High electrical insulation
    ■ High compression rate
    ■ Low compression force


    Typical applications
    ■ Between electronic components such as Semiconductor, IC, CPU.MOS and heatsink.
    ■ Led Lighting, LCD TV, Telecom device, wireless Hub,NB, PC, power supply etc
    ■ CD ROM/DVD ROM
    ■ Cooling Module, Thermal module, in all applications where a metal housing is used as heatsink.


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