High Quality Black 4 Inch ESD Waffle Pack Tray For Micro IC Chips
Custom-engineered waffle packs reduce die shift, improve pick
accuracy, and protect fragile chips throughout the supply chain.
Hiner-pack production IC tray waffle pack is in line with
international environmental standards, through the ROHS and SGS
third party inspection, such as raw material of the raw material
buying from domestic leading manufacturer, incoming inspection and
related technology and strictly control the quality during
production, quality department must confirm the product 100%
qualified before shipment, are sold to domestic and international
famous customers over the years, After the use of positive
feedback, rich experience in injection molding industry also
provides customers with the most appropriate packaging solutions.
It is by virtue of an excellent professional team and unremitting
efforts that Hiner-pack has been widely recognized by customers in
the field of semiconductor materials. We take quality as the basis
of survival and development, cooperate with customers and partners,
long-term development, committed to become the semiconductor
industry manufacturing and process materials in the world's leading
service providers.
Waffle Pack is usually used to carry smaller chips or components,
and the product can be matched with the cover plate, clip, Tyvek
paper, and other corresponding accessories. Our company provides
complete packaging services to ensure the safety of customers'
product transfer, transportation, and storage.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 101.6*101.6*4.5mm |
| Model | HN21077 | Cavity Size | 13.2*1.2*0.32mm |
| Package Type | IC Parts | Matrix QTY | 26*5=130PCS |
| Material | PC | Flatness | MAX 0.1mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | TBC | Customizable |
| Provide professional design and packaging for your products |
Application:
Wafer Die / Bar / Chips; PCBA module component; Electronic component packaging; Optical device packaging
Service:
1. We have sample stock, which can also help the client to choose
which type is suitable for them.
2. We will reply to you at any time if you have questions.
3. Choose a suitable product for clients according to the clients'
requirements.
4. After mold customization, free samples will be provided until
the customer tests OK, so as to remove the mass production quality
concerns of customers before production.
FAQ:
Q1: Are You a Manufacturer or a Trade Company?
A: We are a 100% Manufacturer specializing in packaging for over 12
years with a 1500 square meter workshop area, located in Shenzhen,
China.
Q2. Can I order if the quantity is less than the MOQ?
A: Yes, and it would be taken as a sample order to production. We
take more serious on sample order.
Q3. Can I get Free Samples?
A: Yes, if the samples we have in stock are provided for testing,
but the shipment should be at your side.
If samples are needed to customize with your logo and designs,
please send us designs and advise on chip, quantity, and any other
details required. Thank you.
Q4. Do you arrange shipments for the products?
A: It depends on our Incoterms. If the FOB or CIF price, we will
arrange shipment for you, but EXW price, clients need to arrange
shipment by themselves or their agents.
