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50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas

    Buy cheap 50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas from wholesalers
     
    Buy cheap 50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas from wholesalers
    • Buy cheap 50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas from wholesalers
    • Buy cheap 50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas from wholesalers

    50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas

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    Brand Name : Bicheng
    Model Number : BIC-057.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
    • Product Details
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    50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas


    Rogers RF PCBs Built on RO3210 50mil 1.27mm DK10.2 With Immersion Gold for Microstrip Patch Antennas

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    Rogers RO3210 high frequency circuit materials are ceramic-filled laminates reinforced with woven fiberglass. These materials are engineered to offer exceptional electrical performance and mechanical stability. RO3210 laminates combine the surface smoothness of a non-woven PTFE laminate. Since these materials can be fabricated into PCB using standard PTFE circuit board processing techniques, it results in the mass production and get competitive price on the market. The dielectric constant of RO3210 substrate is 10.2 with a dissipation factor of 0.0027.


    Typical application:

    1. Base station infrastructure

    2. LMDS and wireless broadband

    3. Microstrip patch antennas

    4. Wireless telecommunications systems


    PCB SIZE102 x 102mm=1PCS
    BOARD TYPEDouble sided PCB
    Number of Layers2 layers
    Surface Mount ComponentsYES
    Through Hole ComponentsYES
    LAYER STACKUPcopper ------- 18µm(0.5 oz)+plate TOP layer
    RO3210 1.270mm
    copper ------- 18µm(0.5 oz)+plate BOT layer
    TECHNOLOGY
    Minimum Trace and Space:6 mil / 4 mil
    Minimum / Maximum Holes:0.4 mm / 2.5 mm
    Number of Different Holes:8
    Number of Drill Holes:32
    Number of Milled Slots:0
    Number of Internal Cutouts:NO
    Impedance Control:no
    Number of Gold finger:0
    BOARD MATERIAL
    Glass Epoxy:RO3210 1.270mm
    Final foil external:1 oz
    Final foil internal:1 oz
    Final height of PCB:1.3 mm ±10%
    PLATING AND COATING
    Surface FinishImmersion gold
    Solder Mask Apply To:N/A
    Solder Mask Color:N/A
    Solder Mask Type:N/A
    CONTOUR/CUTTINGRouting
    MARKING
    Side of Component LegendN/A
    Colour of Component LegendN/A
    Manufacturer Name or Logo:N/A
    VIAPlated through hole(PTH), minimum size 0.4mm.
    FLAMIBILITY RATINGUL 94-V0 Approval MIN.
    DIMENSION TOLERANCE
    Outline dimension:0.0059"
    Board plating:0.0029"
    Drill tolerance:0.002"
    TEST100% Electrical Test prior shipment
    TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
    SERVICE AREAWorldwide, Globally.


    RO3210 Typical Value
    PropertyRO3210DirectionUnitsConditionTest Method
    Dielectric Constant,εProcess10.2±0.5Z10 GHz 23℃IPC-TM-650 2.5.5.5 Clamped Stripline
    Dielectric Constant,εDesign10.8Z8GHz to 40 GHzDifferential Phase Length Method
    Dissipation Factor,tanδ0.0027Z10 GHz 23℃IPC-TM-650 2.5.5.5
    Thermal Coefficient of ε-459Zppm/℃10 GHz 0℃to 100℃IPC-TM-650 2.5.5.5
    Dimensional Stability0.8X, Ymm/mCOND AASTM D257
    Volume Resistivity103MΩ.cmCOND AIPC 2.5.17.1
    Surface Resistivity103COND AIPC 2.5.17.1
    Tensile Modulus579
    517
    MD
    CMD
    kpsi23℃ASTM D 638
    Water Absorption<0.1-%D24/23IPC-TM-650 2.6.2.1
    Specific Heat0.79j/g/kCalculated
    Thermal Conductivity0.81W/M/K80℃ASTM C518
    Coefficient of Thermal Expansion
    (-55 to 288℃)
    13
    34
    X,Y
    Z
    ppm/℃23℃/50% RHIPC-TM-650 2.4.4.1
    Td500TGAASTM D3850
    Density3gm/cm3
    Copper Peel Stength11pli1oz,EDC After Solder FloatIPC-TM 2.4.8
    FlammabilityV-0UL 94
    Lead-free Process CompatibleYes

    Quality 50mil RO3210 RF Rogers PCB Board With Immersion Gold For Microstrip Patch Antennas for sale
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