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8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm

    Buy cheap 8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm from wholesalers
     
    Buy cheap 8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm from wholesalers
    • Buy cheap 8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm from wholesalers
    • Buy cheap 8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm from wholesalers
    • Buy cheap 8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm from wholesalers
    • Buy cheap 8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm from wholesalers
    • Buy cheap 8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm from wholesalers

    8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm

    Ask Lasest Price
    Brand Name : WITGAIN PCB
    Model Number : Multi-Layer PCB0026
    Certification : UL
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 100k pcs/month
    Delivery Time : 20 days
    • Product Details
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    8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm

    Multi Layer Circuit Board 8 Layer Printed Circuit Board Red Solder Mask


    PCB Specifications:


    1 Part NO: Multi-Layer PCB0026

    2 Layer Count: 8 Layer PCB

    3 Finished Board Thickness: 2.0MM

    4 Copper Thickness: 1/1/1/1/1/1 OZ

    5 Min Lind Space&Width: 4/4 mil

    6 Application Area: Industrial Control



    Material Data Sheet:


    S1130
    ItemsMethodConditionUnitTypical Value
    TgIPC-TM-650 2.4.25DSC135
    TdIPC-TM-650 2.4.24.65% wt. loss310
    CTE (Z-axis)IPC-TM-650 2.4.24Before Tgppm/℃65
    After Tgppm/℃310
    50-260℃%4.5
    T260IPC-TM-650 2.4.24.1TMAmin13
    T288IPC-TM-650 2.4.24.1TMAmin<1
    Thermal StressIPC-TM-650 2.4.13.1288℃, solder dip--60S No Delamination
    Volume ResistivityIPC-TM-650 2.5.17.1After moisture resistanceMΩ.cm4.8E + 08
    E-24/125MΩ.cm4.6E + 06
    Surface ResistivityIPC-TM-650 2.5.17.1After moisture resistance5.2E + 07
    E-24/1255.3E + 06
    Arc ResistanceIPC-TM-650 2.5.1D-48/50+D-4/23s120
    Dielectric BreakdownIPC-TM-650 2.5.6D-48/50+D-4/23kV60
    Electrical StrengthIPC-TM-650 2.5.6.2D-48/50+D-4/23kV/mm
    Dissipation Constant (Dk)IPC-TM-650 2.5.5.91MHz--4.6
    IEC 61189-2-72110GHz--
    Dissipation Factor (Df)IPC-TM-650 2.5.5.91MHz--0.016
    IEC 61189-2-72110GHz--
    Peel Strength(1oz HTE copper foil)IPC-TM-650 2.4.8AN/mm
    After thermal Stress 288℃,10sN/mm1.8
    125℃N/mm1.6
    Flexural StrengthLWIPC-TM-650 2.4.4AMPa600
    CWIPC-TM-650 2.4.4AMPa500
    Water AbsorptionIPC-TM-650 2.6.2.1E-1/105+D-24/23%0.15
    CTIIEC30112C-48/23/50,PLC 3
    FlammabilityUL94C-48/23/50RatingV-0
    E-24/125RatingV-0

    Our Product Categories:


    Our Product Categories
    Material KindsLayer CountsTreatments
    FR4Single LayerHASL Lead Free
    CEM-12 Layer/Double LayerOSP
    CEM-34 LayerImmersion Gold/ENIG
    Aluminum Substrate6 LayerHard Gold Plating
    Iron Substrate8 LayerImmersion Silver
    PTFE10 LayerImmersion Tin
    PI Polymide12 LayerGold fingers
    AL2O3 Ceramic Substrate14 LayerHeavy copper up to 8OZ
    Rogers, Isola high frequency materials16 LayerHalf plating holes
    Halogen free18 LayerHDI Laser drilling
    Copper based20 LayerSelective immersion gold
    22 Layerimmersion gold +OSP
    24 LayerResin filled in vias


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