MCU Board Chips Flash DP83869HMRGZT Electronic IC Chip
| Categories | Integrated Circuits (ICs) |
| Features | 1/1 Transceiver - Ethernet 48-VQFN (7x7) |
| Manufacturer | Texas Instruments |
| Package | Reel - TR |
| Operating Temperature Range | -40°C ~ 125°C (TA) |
| Mounting | Surface Mount |
| Package | 48-VFQFN Exposed Pad |
| Case / Package | 48-VQFN (7x7) |
| Family Name | DP83869 |
| MSL Level | 2 (1 Year) |
| REACH Status | REACH Unaffected |
| ECCN | 5A991B1 |
| HTSUS | 8542.39.0001 |
| Quantity per package | 250 |
| Fake Threat In the Open Market | 57 pct. |
| Popularity | Medium |
| Supply and Demand Status | Limited |
Features
• Multiple Operating Modes
– Media Support: Copper and Fiber
– Media Conversion Between Copper and Fiber
– Bridge Between RGMII and SGMII
• Maximum Ambient Temperature of 125ºC
• Exceeds 8-kV IEC61000-4-2 ESD
• Low RGMII Latency
– Total Latency ≤ 384ns for 1000Base-T
– Total Latency ≤ 361ns for 100Base-TX
• Low Power Consumption
– < 150 mW for 1000Base-X
– < 500 mW for 1000Base-T
• Time Sensitive Network (TSN) Compliant • Recovered Clock Output
for SyncE
• Selectable Synchronized Clock Output: 25 MHz and 125 MHz
• 1000Base-X, 100Base-FX Compatible With SFP MSA Specification
• IEEE1588 Support via SFD
• Wake On LAN Support
• Configurable IO Voltages: 1.8 V, 2.5 V, and 3.3 V
• SGMII, RGMII, MII MAC Interface
• Jumbo Frame Support for 1000M and 100M Speed
• Cable Diagnostics
– TDR
– BIST
• Programmable RGMII Termination Impedance
• Integrated MDI Termination Resistor
• Fast Link Drop modes
• Compatible to IEEE 802.3 1000Base-T, 100BaseTX,
10Base-Te,1000Base-X, 100Base-FX
Applications
• Industrial Factory Automation
• Grid Infrastructure
• Motor and Motion Control
• Test and Measurement
• Building Automation
Description
The DP83869HM device is a robust, fully-featured Gigabit Physical
Layer (PHY) transceiver with integrated PMD sublayers that supports
10BASE-Te, 100BASE-TX and 1000BASE-T Ethernet protocols.
The DP83869 also supports 1000BASE-X and 100BASE-FX Fiber
protocols. Optimized for ESD protection, the DP83869HM exceeds 8-kV
IEC 61000-4-2 (direct contact).This device interfaces to the MAC
layer through Reduced GMII (RGMII) and SGMII. In 100M mode, the
device lets the designer use MII for lower Latency. Programmable
integrated termination impedance on RGMII/MII helps reduce system
BOM.
The DP83869HM supports Media Conversion in Managed mode. In this
mode, the DP83869HM can run 1000BASE-X-to-1000BASE-T and
100BASE-FXto-100BASE-TX conversions. The DP83869HM can also support
Bridge Conversion from RGMII to SGMII and SGMII to RGMII. The
DP83869HM is compliant to TSN standards and offers low latency.
