UV Laser PCB Cutting Without Mechanical Stress For FPC/PCB
Depaneling
UV Laser PCB Cutting Applications:
FPC and some relative materials, FPC/PCB/ Rigid-Flex PCB cutting,
Camera module cutting
UV Laser PCB Cutting Advantages:
No mechanical stress on substrates or circuits
No tooling cost or consumables.
Versatility – ability to change applications by simply changing
settings
Fiducial Recognition – more precise and clean cut
Optical Recognition before PCB depaneling/singulation process
begins. CMS Laser is one of the few companies to provide this
feature.
Ability to depanel virtually any substrate. (Rogers, FR4, ChemA,
Teflon, ceramics, aluminum, brass, copper, etc)
Extraordinary cut quality holding tolerances as small as < 50
microns.
No design limitation – ability to cut virtually and size PCB board
including complex contours and multidimensional boards
UV Laser PCB Cutting Specifications:
| Power | 380V AC, 50Hz, 20A |
| Compressed Air | Compressed air |
| Machine Dimension | 1450(L)x1350(W)x1665(H)mm |
| Installation Space | 3000x3000x2500mm |
| Machine Weight | 2000kgs |
| Ambient Temperature | 22 ~ 25 ℃ |
| temperature variation | within ± 1 ℃ / 24hr |
| ambient humidity | within 40% ~ 70% (no obvious condensation is allowed) |
| Dust free grade | 100000 or better |
| power consumption | 6KW |
| Cutting width | ≤ 50mm × 50mm |
| Cutting materials | full cut / half cut of PCB / FPC, LCP / glue and other related
materials |
| Cutting thickness | ≤ 3mm |
| Cutting speed | ≤ 3000mm / S |
| Overall machining accuracy | ≤ 30um |
| Processing pattern | straight line, slash, curve, abnormity, etc |
UV Laser PCB Cutting Laser Source:
| Laser | 355nm light wave nanosecond laser |
| Repetition frequency | 50-150khz |
| Laser Powe | UV 15W@30KHz |
| Pulse width | < 20ns |
| Energy stability | < 3% RMS over 8hours |
| Beam quality m ² | < 1.3 |
| Mode | 2500mm/S |
UV Laser PCB Cutting Features:
1. Effectively control the processing heat effect, and improve the
edge collapse and thermal effect of the product.
2. High quality laser, no contact processing, no burr and burr
after cutting. Mature process system can accurately calculate and
segment the graphics, and realize the process of processing
parameters and processing graphics.
3. No stress, ±5μm cutting precision.
4. Import gerber file for easy operation. Alien/line cutting is
available.
5. Non-contact, smooth cutting edge.
