Application Introduction:
In the process of using LED light-emitting module, we must pay
attention to the problem of voltage drop. Never make only one
circuit, from the first series to the end. This will not only lead
to inconsistent brightness due to different voltages between the
head and tail, but also cause the problem of excessive single
circuit current burning the circuit board. The correct approach is
to connect more circuits in parallel as much as possible to ensure
the reasonable distribution of voltage and current. In addition, if
anti-corrosion materials need to be used inside the word cavity, it
is best to use white primer to increase its reflection coefficient.
High brightness 2835 9v 0.5w smd led chip 80-85lm for bulb lamp
Quick details:
| Input Voltage(V): | 9V |
| Warranty(Year): | 2-Year |
| Type: | Smd Led Chip 2835 |
| Lighting solutions service: | Lighting and circuitry design |
| Luminous Efficacy(lm/w): | 160lm/w |
| Lifespan (hours): | 50000 |
| Working Time (hours): | 20000 |
| Chip Material: | INGAN |
| Emitting Color: | 2700k 3000k 6500k |
| Power: | 0.5w |
| Viewing Angle(°): | 120 Degree |
| Color Rendering Index(Ra): | 80 |
| Packing bag: | 220*240nm |
| Place of Origin: | Suzhou ,jiangsu |
| Application: | LED STRIP |
| Package Type: | Suface Mount Package |
| Forward Current: | 60MA |
| Size: | 2.8*3.5*0.65mm |
| Packing: | 4000 Pcs/Roll |
Product specification:
Package Structure
Absolute Maximum Ratings
Item
| Symbol
| Absolute Maximum Ratings
| Unit
|
| Forward Current | IF | 60 | mA |
| Reverse Voltage | Vr | 15 | V |
| Pulsed Forward Current | IFP* | 90 | mA |
| Power dissipation | PD | 1 | W |
| Operating Temperature | TOP | -40~115 | ℃ |
| Storage Temperature | TST | -40~85 | ℃ |
| Electrostatic Discharge | ESD | 2000(HBM) | V |
| Junction Temperature | Tj | 125 | ℃ |
| LED Thermal resistance | Rth s-j | 20 | ℃/W |
|
Typical Electro-Optical characteristics curves:
LED Reliability Test List
| Test Item | Test Conditions | Standard | Qty(Pcs) | Ac/Re |
| Life Test | 25℃,1000Hrs@20mA | / | 22 | 0/1 |
High Temperature
| 85℃,1000Hrs@20mA | / | 22 | 0/1 |
Low Temperature
| -40℃,1000Hrs@20mA | / | 22 | 0/1 |
High Humidity Heat
| 85℃,85%RH, 1000Hrs@20mA | / | 22 | 0/1 |
| Low Temperature Storage | -40℃,1000Hrs | JEITA ED-4701 200 202 | 22 | 0/1 |
| High Temperature Storage | 100℃,1000Hrs | JEITA ED-4701 200 201 | 22 | 0/1 |
Temperature Cycle
| (-40'C 30mins --25'C(5mins)--100'C(30mins) ,Temp changing
rate:3+/-0.6'C/min) | JEITA ED-4701 100 105 | 22 | 0/1 |
| Thermal Shock | -40'C(15mins) --100'C(15mins),changing time <5mins ,300C | MIL-STD-202G | 22 | 0/1 |
Pulse Life Test
| Tp=1ms,DC=0.1,D=Tp/T @ 3×20mA | / | 22 | 0/1 |
ESD Test(HBM)
| 2000V,200V/Step, Forward & Reverse Test both 3times | AEC (Q101-001) | 22 | 0/1 |
Soldering Resistance
| 260±5℃,10S,3times Pre-treatment 30℃,70%RH | JEITA ED-4701 300 302 | 22 | 0/1 |
Reflow IV Decay
| 260±5℃,10S,1time Pre-treatment 30℃,70%RH,168Hrs | / | 22 | 0/1 |
| Judgment Criteria |
| Forward Voltage VF | VF Max-Increase < 1.1x |
| Reverse Current IR | IR Max-Increase < IRmax |
| Luminous Intensity IV | IV Decay < 40% |
※Solder ability test criteria:coverage is not less than 95% Note:Measurement shall be taken after the tested samples have been
returned to normal ambient conditions (generally after two hours) |
Packaging:
Cautions:
The encapsulated material of the LEDs is silicone. Therefore the
LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence
to the reliability of the LEDs. Precautions Should be taken to
avoid the strong pressure on the encapsulated part. So when use the
picking up nozzle,The pressure on the silicone resin should be
proper.
Soldering iron :
When hand soldering, the temperature of the iron must less than
300℃ for 3 seconds
The hand solder should be done only one times
SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following
Handling Precautions :
Handle the component along the side surface by using forceps or
appropriate tools
Do not directly touch or handle the silicone lens surface. It may
damage the internal circuitry
Do not stack together assembled PCBs containing LEDs. Impact may
scratch the silicone lens or damage the internal circuitry
Product features:
Adopt good quality chip and frame ,antistatic good stability Ultra
low attenuation
High brightness ,low attenuation high color rendering
Minimum 70,80,90 95 CRI options
Strong welding and good stability undead light
Product series and company logo on the front
CE ROHS LM80 Certification
Production Process:
