Application Introduction:
In the electronic industry, backlight is a form of lighting, which
is often used in LCD display. The difference between backlight and
front light is that the backlight shines from the side or back,
while the front light shines from the front as the name suggests.
They are used to increase the illumination in low light source
environment and the brightness on computer monitors and LCD screens
to produce light in a similar way to CRT displays.
SMD LED chip 3030 54v 20ma
Quick details:
| Input Voltage(V): | 18V |
| Warranty(Year): | 2-Year |
| Type: | Smd Led Chip 3030 |
| Lighting solutions service: | Lighting and circuitry design |
| Luminous Efficacy(lm/w): | 160LM |
| Lifespan (hours): | 50000 |
| Working Time (hours): | 20000 |
| Chip Material: | INGAN |
| Emitting Color: | Warm White/Natural White/COOL WHITE |
| Power: | 1W |
| Viewing Angle(°): | 120 Degree |
| Color Rendering Index(Ra): | 80 |
| Color Temperature: | 2700-6500K red green blue |
| Place of Origin: | Suzhou ,jiangsu |
| Application: | logo exhibition light |
| Package Type: | Suface Mount Package |
| Forward Current: | 30MA |
| Size: | 3.0*3.0*0.6mm |
| Packing: | 4000 Pcs/Roll |
Product specification:
Package Structure:
Absolute Maximum Ratings:
| Item | Symbol | Maximum | Unit |
| Power dissipation | PD | 1 | W |
| Continuous forward current | IFmax | 60 | mA |
| Peak forward current (1/10 duty cycle 10ms pulse width) | IFP | 80 | mA |
| Reverse voltage | VR | 5 | V |
| Electrostatic Discharge (HBM) | ESD | 2000 | V |
| Operating temperature range | Topr | -40 to +85 | ℃ |
| Storage temperature range | Tstg | -40 to +85 | ℃ |
| Led yunction temperature | Tj | 125 | ℃ |
Electrical/Optical Characteristics:
| Item | Symbol | Condition | Color | Min | Typ | Max | Unit |
Forward voltage |
VF |
IF=60mA | R | 17.5 | 18.5 | 19 | V |
| G | 17.5 | 18.5 | 19 | V |
| B | 17.5 | 18.5 | 19 | V |
| Viewing Angle | 2θ1/2 | IF=60mA | R/G/B | - | 120 | - | Deg |
Luminous Intensity |
IV | I IF=60mA
| R | | - | | LM |
| G | | - | | LM |
| B | | - | | LM |
Wavelength |
WLD | IF=60mA | R | 615 | - | 620 | nm |
| G | 515 | - | 520 | nm |
| B | 452 | - | 457.5 | nm |
| Reverse Current | Ir | Vr=7V | R/G/B | 0 | | 1 | uA |
| Thermal resistance | Rth(j-s) | IF=60mA | R/G/B | | 28 | | ℃/W |
Typical Electro-Optical Characteristic Curves:
Reliability Test Items And Conditions:
| No. | Item | Test Conditions | Test hr/cycle/time | Sample Q’ty | Ac∕Re |
| 1 | Solder Heat | TEMP:260℃±5℃；5±1 sec | 2 times | 30 pcs | 0∕1 |
| 2 | Solder ability Test ※ | TEMP:235℃±5℃；3±1 sec | 1 time | 5 pcs | 0∕1 |
| 3 | Temperature Cycle | H:+100℃ 30min. ∫5min. L:-40℃ 30min. | 100 cycles | 20 pcs | 0∕1 |
| 4 | Thermal Shock | H:+100℃ 5min. ∫ L:-40℃ 5min. | 50 cycles | 20 pcs | 0∕1 |
| 5 | High Temperature Storage | TEMP:100℃ | 1000 hrs | 20 pcs | 0∕1 |
| 6 | Low Temperature Storage | TEMP:-40℃ | 1000 hrs | 20 pcs | 0∕1 |
| 7 | DC Operating Life | IF＝IFmax | 1000 hrs | 20 pcs | 0∕1 |
| 8 | High Temperature High Humidity | 85℃∕85％R.H. | 1000 hrs | 20 pcs | 0∕1 |
| 9 | Shocking test | 100～2000Hz ；98.1m/s2 X,Y,Z direction | 2 hrs | 20 pcs | 0∕1 |
| 10 | Dropping test | Put on pallet ；height:75cm | 3 times | 20 pcs | 0∕1 |
| Judgment Criteria |
| Forward Voltage VF | VF Max-Increase < 1.1x |
| Reverse Current IR | IR Max-Increase < IRmax |
| Luminous Intensity IV | IV Decay < 40% |
※Solder ability test criteria:coverage is not less than 95% Note:Measurement shall be taken after the tested samples have been
returned to normal ambient conditions (generally after two hours) |
Packaging:
Cautions:
The encapsulated material of the LEDs is silicone. Therefore the
LEDs have a soft surface on the
Top of package. The pressure to the top surface will be influence
to the reliability of the LEDs. Precautions Should be taken to
avoid the strong pressure on the encapsulated part. So when use the
picking up nozzle,The pressure on the silicone resin should be
proper.
Soldering iron :
When hand soldering, the temperature of the iron must less than
300℃ for 3 seconds
The hand solder should be done only one times
SMT Reflow Soldering Instructions SMT :
Reflow soldering should not be done more than two times
When soldering , do not put stress on the LEDs during heating
The recommended reflow soldering profile as following
Handling Precautions :
Handle the component along the side surface by using forceps or
appropriate tools
Do not directly touch or handle the silicone lens surface. It may
damage the internal circuitry
Do not stack together assembled PCBs containing LEDs. Impact may
scratch the silicone lens or damage the internal circuitry
Product features:
Adopt good quality chip and frame ,antistatic good stability Ultra
low attenuation
High brightness ,low attenuation high color rendering
Minimum 70,80,90 95 CRI options
Strong welding and good stability undead light
Product series and company logo on the front
CE ROHS LM80 Certification
Production Process:
