SMT DIP Soldering ROHS HASL ENIG Lead Free Turnkey PCB Assembly
Fabrication
Technical Requirement for turnkey pcb assembly
1) Professional Surface-mounting and Through-hole soldering
Technology
2) Various sizes like 1206, 0805, 0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) Turnkey PCB Assembly With CE, FCC, Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.
What CESGATE provide?
1. Reasonable and competitive price
2. Provide component selection service for customers, including
alternative component selection service for out of stock components
3. Expedited service is supported for those urgent orders
4. Complete after-sales services
CESGATE's advantages of turnkey PCB assembly
CESGATE is not only a leading PCB manufacturer, but also can meet
your assembly and component sourcing needs. We will purchase the
components in the BOM while producing the PCB, and start the
assembly at the fastest speed. CESGATE is equipped with multiple
high-end equipments, such as: FUJI XPF, NXT3, AIMEX,
AOI/SPI/XRAY/First article tester etc., min. mount: 03015, 01005,
0201, 0402
In the PCB industry for more than ten years, a standardized and
rigorous process and system has been established to effectively
reduce quality problems
Specification
| Article | Description | Capability |
| Material | Laminate materials | FR4, High TG FR4, High Frequency, Alum, FPC... |
| Board Cutting | Number of layers | 1-48 |
Min.thickness for inner layers
(Cu thickness are excluded) | 0.003”(0.07mm) |
| Board Thickness | Standard | (0.1-4mm±10%) |
| Min. | Single/Double:0.008±0.004” |
| 4layer:0.01±0.008” |
| 8layer:0.01±0.008” |
| Bow and twist | no more than 7/1000 |
| Copper Weight | Outer Cu weight | 0.5-4 0z |
| Inner Cu weight | 0.5-3 0z |
| Drilling | Min size | 0.0078”(0.2mm) |
| Drill deviation | ±0.002″(0.05mm) |
| PTH hole tolerance | ±0.002″(0.005mm) |
| NPTH hole tolerance | ±0.002″(0.005mm) |
| Solder Mask | Color | Green,white,black,red,blue… |
| Min solder mask clearanace | 0.003″(0.07mm) |
| Thickness | (0.012*0.017mm) |
| Silkscreen | Color | white,black,yellow,blue… |
| Min size | 0.006″(0.15mm) |
| Max Size of Finish Board | 700*460mm |
| Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP… |
| PCB Outline | Square,circle,irregular(with jigs) |
| Package | QFN,BGA,SSOP,PLCC,LGA |
FAQ
Q: What is your delivery date?
CESGATE: The general sample delivery time is 6 working days for
single and double-sided boards, 7 working days for 4-layer boards,
and an additional working day for every 2 layers. However, if there
are special processes, additional working days will be added
according to the situation.
Generally, the delivery time for mass production is 10 working days
for single and double-sided panels, and 15 working days for
multi-layer panels. However, if there is a special process or more
than a certain number of working days, the working days will be
additionally increased according to the situation; you can also pay
the urgent fee to shorten the number of days, please contact
Contact the business specially proposed, depending on the
individual situation to provide expedited days. |
Q: What is the difference between the HDI board and the general
circuit board?
CESGATE: Most of HDI use laser to form holes, while general circuit
boards only use mechanical drilling, and HDI boards are
manufactured by the build-up method (Build Up), so more layers will
be added, while general circuit boards are only added once. |
Q: What are the types of solder mask?
CESGATE: There are traditional epoxy resin IR baking type, UV
curing type, Liquid Photo Imageable Solder Mask and Dry film solder
mask. Currently, the liquid solder mask is the main type. |
Q: What are the common substrates of CESGATE?
A:Tg-140: ISOLA FR402 / NAN-YA NP-140
Tg-150: ISOLA IS400 / NAN-YA NP-155
Tg-170~180: ISOLA 370HR / NPN-YA / NAN-YA NP-175F |
