Dual Table PCB Laser Depaneling Machine High Productivity

Dual Table High Productivity PCB Laser Depaneling PCB Depanelizer Machine

Laser Depaneling Purpose:

The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations.

Efficient integration of all components of the equipment, including laser, optical path, galvanometer system, 4-axis motion platform and image

System to achieve efficient and accurate operation.

Laser Depaneling Specifications:

Laser Depaneling Laser Source:

Laser Depaneling Features:

Effectively control the processing heat effect, and improve the edge collapse and thermal effect of the product. High quality laser, no contact processing, no burr and burr after cutting. Mature process system can accurately calculate and segment the graphics, and realize the process of processing parameters and processing graphics. No stress, ±5μm cutting precision. Import gerber file for easy operation. Alien/line cutting is available. Non-contact, smooth cutting edge.

Laser Depaneling Laser Photos:

Laser Depaneling Applications and Cutting Effect:

Application fields: pcb/fpc/pi/cpi/mpi/pcba/cof/cop/cob/fr4/lcp, etc. No dust, good to PCB conductivity.

Factory established in 2005, has built and maintained its reputation as a source of technical

and professional excellence.

Winsmart has a driven, experienced, and knowledgeable team, providing extensive array of solutions

for PCB depaneling and soldering. Above all, it takes pride in the quality and efficient service that it

provides to customers, which is reflected by long-standing relationships across a diverse customer base.

Winsmart will continue to meet customers' requirements by supplying the excellent solution with

unique technology and service!