Lead Free SMT Wave Soldering Machine RF-3S
SMT Machine Mini-Type Lead Free Wave Soldering for Assembly Line
The Features of Mini Wave Soldering Machine RF-3S
1. Totally lead free design.
2. Japan made Mitsubishi PLC Control
3. Shaped stream line design, flexible operation, convenient to be
cleaned and maintained.
4. External casting heating board of tin furnace with high
efficiency.
5. Synchronous insert plate structure Japan made conveyor power
equipped steady transportation.
6. Acoustic and optical warning and emergency brake system.
7. Low oxidation anti-erosion alloyed tin furnace, energy saving
design of spraying nozzle fulfill lead free request absolutely.
8. Preheated by high efficient stainless steel heating pipe, good
heat compensation and high stability.
Parameters of Wave Solder Equipment RF-3S
| Wave Solder | RF-3S |
| Commom of Wave Welding Machine |
| Weight | About 1000KG |
| Dimension: L*W*H ( mm ) | 3400*1100*1650 |
| Power | AC 3Ф380V 50HZ/AC 3Ф220V 60HZ |
| Operation/ Startup Power | 6/28 KW |
| Operating System of Wave Soldering |
| Control Mode | PLC + Control Meter |
| Spraying System of Wave Solder |
| Flux Flow | Throttle Valve |
| Exhaust Method | Upper Exhaust |
| Exhaust Capacity | 25M3/min |
| Auto Flux Feeding | Optional |
| Transmission Method | Air Cylinder |
| Preheating System of Wave Solder |
| Warm Time | Approx. 20/min |
| Preheating Model | IR Tube |
| Preheating Temp. | Room Temperature : ~300C |
| Preheating Length | 1150 MM |
| No. of Preheating Zones | 1 |
Other Information of Wave Soldering Machine :
Wave soldering machine solder joint formation:
When the PCB enters the front end of the wave surface, the
substrate and the pins are heated, and before leaving the wave, the
entire PCB is immersed in the solder, that is, bridged by the
solder, but at the moment it leaves the end of the wave , A small
amount of solder adheres to the pad due to the wetting force, and
due to surface tension, a small state of shrinkage with the lead as
the center appears. At this time, the wetting force between the
solder and the pad is greater than the two pads The cohesion of the
solder between. Therefore, a full, round solder joint will be
formed, and the excess solder leaving the wave tail will fall back
into the tin bath due to gravity.
Product Packing Method of Wave Soldering Machine
RFQ :
1. What is the solder pot capacity for your wave solder machine?
We have 3 types of solder pot, 300KG / 400KG / 450KG
2. What is the solder pot material?
For the leaded solder pot, the material is stainless steel;
For the lead-free solder pot, the material is titanium alloy.
3. How we can set preheating/solder temperature?
If the machine without PC control, you can set the temperature and
other soldering parameters on control panel; if the machine with PC
control, you can set, save, call all parameters in software, and
you can monitor the machine condition on the software interface.
4. What is standard temperature setting for wave solder machine?
Leaded soldering: Preheating1: 100℃ / Preheating2: 110℃ /
Preheating3: 120℃ / Solder pot: 245℃
Lead-free soldering: Preheating1: 100℃ / Preheating2: 110℃ /
Preheating3: 120℃ / Solder pot: 265℃
5. How are can make maintenance for wave solder machine?
Everyday: Cleaning the sundries in the pre-heating zone and solder
pot, and check deviation between setting temperature and the
real-time temperature (once every hour) ; Inspect tin surface
altitude, at circumstance do not turn on the wave crest, the normal
tin’s height should be kept 3-5 mms apart from the solder-pool;
Every week: Periodically cleaning of heating parts, clean out the
oxide in the spray nozzle;
Every three months: Check electric circuit and electric wire
