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Copolymer PES Heat Transfer Powder Glue For Fabric Printing

    Buy cheap Copolymer PES Heat Transfer Powder Glue For Fabric Printing from wholesalers
     
    Buy cheap Copolymer PES Heat Transfer Powder Glue For Fabric Printing from wholesalers
    • Buy cheap Copolymer PES Heat Transfer Powder Glue For Fabric Printing from wholesalers
    • Buy cheap Copolymer PES Heat Transfer Powder Glue For Fabric Printing from wholesalers

    Copolymer PES Heat Transfer Powder Glue For Fabric Printing

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    Brand Name : Easun
    Model Number : ES205
    Certification : Rosh, Reach
    Price : Negotiable
    Payment Terms : T/T
    Supply Ability : 4000000
    Delivery Time : 3-8 working day
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    Copolymer PES Heat Transfer Powder Glue For Fabric Printing

    Copolymer PES Heat Transfer Powder Glue For Fabric Printing

    PES Powder Product model: ES205

    Description:PES powder hot melt adhesive excellent processability.

    Function:Heat transfer,Silk screen printing.

    Physical Characteristics:

    PropertyCriterion
    AppearanceWhite powder
    CompositionCopolyester
    Density ASTM D-7921.20±0.02 g/cm³
    Melt Point DSC125-135 ℃
    Melt Index ASTM D-123822±8 g/10min
    Powder size range0-80 um
    80-170 um
    150-250 um


    Technical Parameters:

    Bonding parameters (for reference only)Temperature140-160℃
    Press1.5-3.0kg/cm2
    Time10-18S
    Washing Resistance40℃Excellent
    60℃/
    90℃/

    Packaging and Storage Conditions:

    Packaging25KG in one PE bag+Brown paper bag
    Storage ConditionsStored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed.


    1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.
    2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.



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