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ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

    Buy cheap ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used from wholesalers
     
    Buy cheap ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used from wholesalers
    • Buy cheap ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used from wholesalers

    ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

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    Brand Name : ASM
    Model Number : NOVA Plus
    Payment Terms : 20% deposit - 80% before delivery
    Price : Negotiable
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    ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used

    ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used


    ASM NOVA Plus Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder


    ASM AMICRA's highly accurate die bonder / flip chip bonder system (+/-2,5 µm), with multi-chip capability, a modular machine concept and much more. The Nova Plus Die Bonder / Flip Chip Bonder has a wide range of features.


    Infinite Automation has a big quantity of stock for Semiconductor related equipment. Among our featured machines are original and used ASM NOVA Plus Die Bonder and Flip Chip Bonder. Infinite Automation has more than 200 hundred units of Die Bonding and Die Attach, and Wire Bonding machines available. Infinite Automation is a trusted China supplier of best-conditioned pre-owned factory automation machines and production line equipment. Contact our Sales and Customer Support Team for inquiries.


    ASM NOVA Plus Die Bonder and Flip Chip Bonder


    Dimensions

    W x D x H

    1240 x 2140 x 1980 mm


    Features:

    • high precision die bonder / flip chip bonder
    • accuracy +/- 2.5 µm @ 3s
    • a cycle- time of < 3 sec*
    • modular machine concept for all micro-assembly applications
    • eutectic bonding via diode-laser, a heating plate or epoxy stamping and dispensing
    • multi flip-chip bonding
    • wafer mapping
    • post bond inspection/ measurement
    • substrate working area of 550 x 600 mm
    • active bond-force-control

    Autoloading for up to:

    • 12" wafers
    • 300 mm wafers
    • 450 mm substrate wafers

    Optional:

    • UV- Curing
    • Dispensing

    ... and more!


    The Nova Plus Die Bonder / Flip Chip Bonder is designed for the following markets:

    • Semiconductor advanced packaging- (TSV, eWLB, Fan-Out, WLP, 3D, Stack Die)
    • MEMS
    • Automotive Sensors
    • RFID
    • LED
    • Optoelectronic


    Quality ASM NOVA Plus Flip Chip Die Bonder Machine Original And Used for sale
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