VT S1080 Automatic Optical Inspection Machine Original And Used
Omron 3D AOI VT-S1080, Original and Used Automatic Optical
Inspection Machine
The VT-S1080 is the world’s most advanced 3D AOI system, designed
for maximum System Performance and High-Quality Productivity.
Designed for flexible manufacturing, saving manpower with innovative AI Programming. First Pass Yield efficiency up to 99%. Industry-first MDMC
Illumination: 3D imaging from all angles enables accurate
inspection of complicated solder shapes. Elimination of Shadow and Secondary Reflection with 4-Direction MPS
Projectors. Realization of Solder Wetting Direction directly relating to IPC
Standards. Innovative AI tools that support skill-less labor-saving tuning. Full 3D compliance to IPC – based inspection. Advanced angle-view inspection of hidden solder joints. Developed with I4.0 in mind for advanced Machine to Machine
communication. Multi-lateral system monitoring and Predictive Maintenance for
100%, utilization for Production. Global Library to maintain the same quality standard of
manufacturing in all global sites. High reliability OCR / OCV image detection. Unique Single Hardware
across all S10 Series Platforms. Prepared for the next-generation
hardware, camera/GPU/PC for higher detectability/speed capability.
Omron 3D AOI VT-S1080
FOV 50.0 x 37.5mm
Max PCB: 510(W) x 680(D)mm
Weight Approx. 1250 kg
Dimensions 1180(W) x 1450(D) x 1500(H)mm
Features:
- S1080 features tab images misc
- AI-assisted qualitative inspection conforming to international
standards
- Since values conforming to the standards are directly applied as
inspection criteria, there is no dependency on the skill and
expertise of the programmer.
AI technology to minimize programming and visual inspection efforts
1. AI self-optimization
2. Automatically acquire defect images for analysis and
visualization of result data separation for AI-assisted defect
determination
High-precision solder shape reconstruction
Equipped with our unique MDMC (Multi Direction/Multi-Color)
illumination and new MPS (Micro Phase Patented Shift) moiré
technique. This enables higher robust and reliable inspection
performance.
M2M*1 system focusing on quality
1. Preventing defects by:
monitoring and reporting fluctuations in the measured values during
production
visualizing defect trends associated with chip mounter hardware
such as heads and nozzles
2. Visualizing the quality by:
process comparison
displaying production status
linking SPI/AOI/AXI systems
3. Improving the first pass yield rate of the line by automatically
calculating post-print/post-placement inspection criteria based on
the inspection results after the solder reflow process
*1. Abbreviation of machine-to-machine. It is a mechanism to
optimize the quality and equipment operation status without human
intervention, made possible by enabling autonomous communication
and exchange of information between various connected, production
equipment.
Specifications:
| Type | VT-S1080 |
| Outer dimensions | 1180(W) x 1450(D) x 1500(H)mm |
| Weight | Approx. 1250 kg |
Power supply | Voltage | 200 to 240 V AC (Single phase); Voltage fluctuation range ±10% |
| Rated power | 2.0 kVA (Maximum current 10 A) |
| Line height | 900±20mm |
| Air supply | Not required |
| Operating temperature range |
10 to 35°C |
| Operating humidity range | 35 to 80% RH (Non-condensing)
|
Vision system | Imaging system | 12M pixel camera |
| Inspection principle | MDMC*1 illumination + 3D reconstruction through MPS*2 technology |
| Image resolution | 12.5µm |
| FOV | 50.0 x 37.5mm |
| Supported PCB size | 50(W) x 50(D)～510(W) x 680(D)mm |
| Weight | (Max) 4 kg |
| Thickness | 0.4～4mm |
Clearance | Above the conveyor belt: 54 mm or less; Below the conveyor belt: 50
mm or less (Including board thickness/curvature/bend/part tolerance, etc.) |
| Height measurement range |
25mm |
Inspection item | Component height, lift, tilt, missing or wrong component, wrong
polarity, flipped component, OCR inspection, 2D code, component
offset (X/Y/rotation), fillet (height/length, end joint width,
wetting angle, side joint length), exposed land, foreign material,
land error, lead offset, lead posture, lead presence, solder ball,
solder bridge, distance between components, component angle |
