Multilayer Rigid Flex PCB
Rigid flex board is a combination of soft board and hard board. It
is a circuit board formed by combining the thin flexible bottom
layer and rigid bottom layer, and then laminating into a single
component. Rigid flexible composite plate has changed the
traditional plane design concept and expanded to the
three-dimensional space concept. It not only brings great
convenience to product design, but also brings great challenges.
The application scope of rigid flex combination board mainly
includes: aerospace, such as high-end aircraft mounted weapon
navigation system, advanced medical equipment, digital camera,
portable camera and high-quality MP3 player. Rigid flexible
composite plates are most commonly used in the manufacture of
military aircraft and medical equipment. The rigid flexible joint
plate brings great benefits to the design of military aircraft,
because it not only improves the connection reliability, but also
reduces the weight. Of course, the benefits brought by the
reduction of the overall volume can not be ignored
Although the cost of rigid flexible composite plate is more
expensive than traditional rigid plate, it provides an ideal
solution for the project. It uses the interconnection of flexible
substrates rather than the connection equipment of multiple PCBs,
which is the key to reduce the occupied space and weight, which is
required by many designs.
The rigid flexible composite board is flexible and foldable, so it
can be used to make customized circuits and maximize the use of
indoor available space, which reduces the space occupied by the
whole system. The overall cost of the rigid flexible composite
board will be relatively high, but with the continuous maturity and
development of the industry, the overall cost will continue to
decrease, Therefore, it will be more cost-effective and
competitive.
HDI Advanced Technology
| Item | HDI Advanced Technology |
| 2019 | 2020 | 2021 |
| Structure | 5+n+5 | 6+n+6 | 7+n+7 |
| HDI Stack Via | AnyLayer(12L) | AnyLayer(14L) | AnyLayer(16L) |
| Board Thickness(mm) | Min. 8L | 0.45 | 0.4 | 0.35 |
| Min. 10L | 0.55 | 0.45 | 0.4 |
| Min. 12L | 0.65 | 0.6 | 0.55 |
| MAX. | | 2.4 | |
| Min. Core Thickness ( um ) | 50 | 40 | 40 |
| Min. PP Thickness ( um ) | 30(#1027PP) | 25(#1017PP) | 20(#1010PP) |
| Base Copper Thickness | Inner Layer ( OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
| Outer Layer ( OZ ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 |
| Item | HDI Advanced Technology |
| 2019 | 2020 | 2021 |
| Min. Mechanical Drill hole size(um) ** | 200 | 200 | 150 |
| Max. Through Hole Aspect Ratio * | 8:1 | 10:1 | 10:1 |
| Min. Laser via/Pad Size ( um ) | 75/200 | 70/170 | 60/150 |
| Max. Laser Via Aspect Ratio | 0.8:1 | 0.8:1 | 0.8:1 |
| Laser Via on PTH(VOP)design | Yes | Yes | Yes |
| Laser X type through hole(DT≤200um) | NA | 60~100um | 60~100um |
| Min. LW/S (L/S/Cu, um) | Inner Layer | 45 /45 /15 | 40/ 40/ 15 | 30/ 30 /15 |
| outer Layer | 50 /50/ 20 | 40 /50 /20 | 40 /40 /17 |
| Min BGA Pitch (mm) | | 0.35 | 0.3 | 0.3 |
| Item | HDI Advanced Technology |
| 2019 | 2020 | 2021 |
| Solder mask Registration (um) | +/- 30 | +/- 25 | +/- 20 |
| Min. Solder Mask Dam (mm) | 0.07 | 0.06 | 0.05 |
| PCB Warpage Control | >= 50ohm | +/-10% | +/-8% | +/- 5% |
| < 50ohm | +/- 5ohm | +/- 3ohm | +/- 3ohm |
| PCB Warpage Control | ≤0.5% | ≤0.5% | ≤0.5% |
| cavity Depth accuracy (um) | Mechanical | +/- 75 | +/- 75 | +/- 50 |
| Laser directly | +/- 50 | +/- 50 | +/- 50 |
| Surface Finishing | OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag | OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG |
| Packaging & Delivery |
| Packaging Details: | Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement. |
| Port: | Shenzhen or Hongkong |
| Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
| Est. Time(days) | 3-5 | 3-5 | 7-9 | To be negotiated |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication,
SMT, plastic injection & metal,final assembly, testing and other
value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic
requirements(material,size, surface finish treatment, copper
thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side
local law and promising tokeep customers data in high confidential
level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home,
Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can
support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing
Street, Bao 'an District, Shenzhen, Guangdong province, China
