PCB aluminum substrate is a unique copper clad metal substrate, PCB
aluminum substrate has good thermal conductivity, electrical
insulation and machining performance.
SMT for PCB aluminum substrate surface; PCB aluminum substrate has good heat dissipation performance in
circuit design.
PCB aluminum substrate can reduce the temperature, improve the
power density and reliability of products, prolong the service life
of products;
PCB aluminum substrate can reduce the volume, reduce the cost of
hardware and assembly;
PCB aluminum substrate can replace ceramic substrate for better
mechanical endurance.
USE:
1. Audio equipment: input, output amplifier, balance amplifier,
audio amplifier, preamplifier, power amplifier, etc.
2. Power supply equipment: switch regulator, DC/AC converter, SW
regulator, etc.
3. Communication electronic equipment: high frequency amplifier,
filter apparatus and transmitting circuit.
4. Office automation equipment: motor drivers, etc.
5. Automobile: electronic regulator, igniter, power controller,
etc.
6. Computer: CPU board, floppy disk drive, power supply device,
etc.
7. Power module: converter, solid relay, rectifier bridge, etc.
Metal based process capability
| Metal based process capability |
| Base Material | Aluminum substrate / copper substrate /
thermoelectric separation copper substrate / copper aluminum
composite plate |
| thermal conductivity | 1.0W/1.5W/2.0W/4.0W/8.0W/122W |
| Board Thickness | 0.2-5.0MM |
| Surface Treatment | HAL lead free,ENIG,OSP,Immersion Tin |
| Maximum size | 1500MM*500MM |
| Minimum size | 5MM*5MM |
| Min. Line Width | 0.1MM(4mil) |
| Min. Line Spacing | 0.1MM(4mil) |
| Min. Hole Size | 0.8mm |
| E-T test | 100% computer open / short circuit test |
| Plate warpage | 0.5%(SIZE:350*350) |
| Withstand voltage | AC1500-4000V |
| Copper Thickness | 25um,35um,70um,105um |
| Forming mode | CNC/V-CUT/Punch/laser cutting |
| Appearance tolerance | CNC:±0.1-0.15MM
Punch:±0.125MM
laser cutting:±0.05MM |
| solder mask colour | White |
| Production process | Exposure process/Thermoelectric separation process |
| date of delivery | Aluminum substrate - sample: 2-3 days; Batch: 5-8 days
Copper substrate - sample: 6 days; Batch: 8-12 days |
| Packaging & Delivery |
| Packaging Details: | Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement. |
| Port: | Shenzhen or Hongkong |
| Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
| Est. Time(days) | 20 | 21 | 25 | To be negotiated |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication,
SMT, plastic injection & metal,final assembly, testing and other
value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic
requirements(material,size, surface finish treatment, copper
thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side
local law and promising tokeep customers data in high confidential
level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home,
Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can
support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing
Street, Bao 'an District, Shenzhen, Guangdong province, China
