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Large SMT Cooling Buffer Machine After The Reflow Oven Process

    Buy cheap Large SMT Cooling Buffer Machine After The Reflow Oven Process from wholesalers
     
    Buy cheap Large SMT Cooling Buffer Machine After The Reflow Oven Process from wholesalers
    • Buy cheap Large SMT Cooling Buffer Machine After The Reflow Oven Process from wholesalers
    • Buy cheap Large SMT Cooling Buffer Machine After The Reflow Oven Process from wholesalers
    • Buy cheap Large SMT Cooling Buffer Machine After The Reflow Oven Process from wholesalers

    Large SMT Cooling Buffer Machine After The Reflow Oven Process

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    Brand Name : INFITEK
    Model Number : BF-L-TN
    Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram
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    Large SMT Cooling Buffer Machine After The Reflow Oven Process

    Large SMT Cooling Buffer Machine After The Reflow Oven Process


    Large Cooling Buffer, Cooling buffer after the Reflow Oven Process, SMT Cooling Buffer Machine for Heavy PCB and PCBA


    INFITEK Large Cooling Buffer is a machine used as a cooling buffer after the Reflow Oven process. The SMT Cooling Buffer Machine is designed for the smooth transmission of heavy PCBA. INFITEK Large Cooling Buffer has a fast cooling effect and is designed to be capable of providing fast, smooth, and accurate retrieval and positioning. With a touch screen controller for easy operation and a fully enclosed design to ensure operational safety. INFITEK Large Cooling Buffer uses durable rollers for transmission (no need to replace belts). FIFO, UFO, and PASS can be set.


    Features:

    • Touch screen controller, easy to operate
    • The fully enclosed design ensures operational safety level
    • Use durable rollers for transmission (no need to replace belts)
    • Three modes: FIFO, UFO, PASS
    • Parallel and smooth width adjustment (ball screw)
    • Fast, smooth, and accurate retrieval and positioning
    • Fast cooling effect
    • Smooth transmission of heavy PCBA

    TECHNICAL PARAMETERS
    DescriptionThis machine is used as a cooling buffer after the reflow oven.
    Cycle timeAbout 10s
    PCB capacity15pcs (pitch 30mm) or customized
    Power supplyAC1P110V/220V
    PowerMax.3000V
    Tran sport height900±20mm(0r customized)
    Transport directionFrom left to right or right to left
    SPECIFICATIONS
    ModelBF-L-TN
    Dimension (L*W*H MM)1500*1495*1760
    PCB size (MM)150*150-1200*350
    Weight (KG)300


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