Gallium Nitride on Sapphire Wafers (GaN)
We grow are sapphire wafers using several methods
- Czrochroski (CZ) process is known to be more efficient for c-axis sapphire
substrate production.
- Heat Exchanger Method (HEM) - Used to grow sapphire crystal in volume.
- Kyropoulos (KY) - grows high quality sapphire but requires an enormous amount of
electricity.
- Edge defined, Film-fed (EFG) - FG technique. A crystal growth process to manufacture more than
10 crystals at one time up to 1.5mm thick per crystal using
multi-tip EFG
Sapphire grown using the CZ, HEM or KY methods is used for
increasing and expand the production, capacity. EFG are usually
used for small volume production.
Sapphire Semiconductor Substrates are available in all Orientations
Orientations include: R-axis; A-axis; C-axis;M-axis.
Sapphire substrates are available in various shapes (circular, rectangle, or square),
from a few mm up to 200mm in size, and finishes according to
customer specification. Primary flats(as per industry standards)
are provided on circular substrates for orientation purposes;
secondary flats are available on request. Substrate thickness'
range from 0.013" (0.25mm) to 0.025" (0.675mm), depending on your
particular application requirements.
We have wafers in stock!
Specs we can provide:
50.8mm 430um SSP and DSP C-M 0.2 Deg
50.8mm 100um SSP and DSP C-plane off to M Plane 0.2 Deg
50.8mm - Other specs and orienations available
100mm 650um SSP
100mm MECH GRADE - LOW PRICE!
Other diameters from but not limited to 10mm x 10mm, 76.2mm, 150mm
and 200mm.
Sapphire Wafers for MOCVD growth of Gallium Nitride (GaN)
Thin-Films
Clients requests sapphire substrates for to grow MOCVD Growth.
Pls see below for the offer,and see the attached for the
manufacturer details and brochures
1. Crystal Materials: 99.995 (or equivalent), High Purity,
Monocrystalline Al2O3.
2. Orientation: M-plane (1-100) Patterned Sapphire Substrate (PSS)
3: Diameter: 50.8 mm ± 0.1 mm (2 inch standard diameter).
4. Thickness: 430 μm ± 25 μm (or equivalent).
5. Primary Orientation Flat (OF): A-plane (1 1 -2 0) ± 0.2° (or
equivalent).
6. Secondary Orientation Flat: NO
7. Front Surface: Epi-polished, Ra 0.3 nm (by AFM) (or better).
8. Back Surface: Fine-ground, Ra =0.5 - 1.2 um (or equivalent).
9. PSS Shape: Cone
10. PSS Dimension: Height 1.5 um, Diameter 1.2-1.8 um, Pitch
1.2-1.8 um.
11. Packaging: Class 100 clean room and vacuum packaging.
12. Packaging Quantity: 25 pieces per cassette.
13. Product Origin: Taiwan . see attached for the manufacturer
details and brochures.
14. M-PSS wafers are to be used for MOCVD growth of gallium nitride
(GaN) thin-films.
15. Qty. [50 Unit ]
Pelase contact us for pricing.
