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High Tg Printed Circuit FR4 PCB Board With Immersion Gold

    Buy cheap High Tg Printed Circuit FR4 PCB Board With Immersion Gold from wholesalers
     
    Buy cheap High Tg Printed Circuit FR4 PCB Board With Immersion Gold from wholesalers
    • Buy cheap High Tg Printed Circuit FR4 PCB Board With Immersion Gold from wholesalers
    • Buy cheap High Tg Printed Circuit FR4 PCB Board With Immersion Gold from wholesalers
    • Buy cheap High Tg Printed Circuit FR4 PCB Board With Immersion Gold from wholesalers
    • Buy cheap High Tg Printed Circuit FR4 PCB Board With Immersion Gold from wholesalers

    High Tg Printed Circuit FR4 PCB Board With Immersion Gold

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    Brand Name : Bicheng
    Model Number : BIC-501.V1.0
    Certification : UL, ISO9001, IATF16949
    Price : USD9.99-99.99
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    High Tg Printed Circuit FR4 PCB Board With Immersion Gold


    High Tg Printed Circuit Board (PCB) Built on 1.6mm TU-872 SLK Sp (Low DK FR-4) With Immersion Gold

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    Brief Introduction

    This is a type of low DK/DF FR-4 PCB which is built on TU-872 SLK Sp material. It is made on 4 layers copper with 1oz each layer, coating immersion gold and green solder mask. Final finished thickness is 1.6mm +/- 10%. A panel consists of 16 pieces.


    Typical Applications

    1. Radio Frequency

    2. Backpanel, High performance computing

    3. Line cards, Storage

    4. Servers, Telecom, Base station

    5. Office Routers



    PCB Specifications

    ItemDescriptionRequirementActualResult
    1. LaminateMaterial TypeFR-4 TU-872 SLK SpFR-4 TU-872 SLK SpACC
    Tg170170ACC
    SupplierTUTUACC
    Thickness1.6±10% mm1.61-1.62mmACC
    2.Plating thicknessHole Wall25µm26.51µmACC
    Outer copper35µm40.21µmACC
    Inner Copper30µm31.15µmACC
    3.Solder maskMaterial TypeKuangshunKuangshunACC
    ColorGreenGreenACC
    Rigidity (Pencil Test)4H or above5HACC
    S/M Thickness10 µm19.55µmACC
    LocationBoth SidesBoth SidesACC
    4. Component MarkMaterial TypeTAIYO/ IJR-4000 MW300IJR-4000 MW300ACC
    ColorWhiteWhiteACC
    LocationC/S, S/SC/S, S/SACC
    5. Peelable Solder MaskMaterial Type
    Thickness
    Location
    6. IdentificationUL MarkYESYESACC
    Date CodeWWYY0421ACC
    Mark LocationSolder SideSolder SideACC
    7. Surface FinishMethodImmersion GoldImmersion GoldACC
    Tin Thickness
    Nickel Thickness3-6µm5.27µmACC
    Gold Thickness0.05µm0.065µmACC
    8. NormativenessRoHSDirective 2015/863/EUOKACC
    REACHDirective 1907 /2006OKACC
    9.Annular RingMin. Line Width (mil)7mil6.8milACC
    Min. Spacing (mil)6mil6.2milACC
    10.V-grooveAngle30±5º30ºACC
    Residual thickness0.4±0.1mm0.38mmACC
    11. BevelingAngle
    Height
    12. FunctionElectrical Test100% PASS100% PASSACC
    13. AppearanceIPC Class LevelIPC-A-600J &6012D Class 2IPC-A-600J &6012D Class 2ACC
    Visual InspectionIPC-A-600J &6012D Class 2IPC-A-600J &6012D Class 2ACC
    Warp and Twist≦0.7%0.32%ACC
    14. Reliability TestTape TestNo PeelingOKACC
    Solvent TestNo PeelingOKACC
    Solderability Test265 ±5OKACC
    Thermal Stress Test288 ±5OKACC
    Ionic Contamination Test 1.56 µg/c0.58µg/cACC

    High Tg PCB

    The thermal properties of the resin system are characterized by the glass transition temperature (Tg), which always is expressed in °C. The most commonly used property is the thermal expansion. When measuring the expansion versus the temperature, we can get a curve as shown in following picture. The Tg is determined by the intersection of the tangents of the flat and steep parts of the expansion curve. Below the glass transition temperature, the epoxy resin is rigid and glassy. When the glass transition temperature is exceeded, it changes to a soft and rubbery state.


    For the most commonly used types of epoxy resin (FR-4 grade), the glass transition temperature is in the range 115-130°C, so when the board is soldered, the glass transition temperature is easily exceeded. The board expands in the Z-axis direction and stresses the copper of the hole wall. The expansion of epoxy resin is about 15 to 20 times greater than that of copper when exceeding Tg. This implies a certain risk of wall cracking in plated-through holes, and the more resin around the hole wall, the greater risk. Below the glass transition temperature, the expansion ratio between epoxy and copper is only three times, so here the risk of cracking is negligible.


    The Tg of general board is above 130 celsius degrees, high Tg is generally greater than 170 celsius degrees, medium Tg is about greater than 150 celsius degrees.


    PCB boards with Tg ≥ 170 ° C are usually called high Tg PCBs.


    Partial High Tg Material in House

    MaterialTg ()Manufacturer
    S1000-2M180Shengyi
    TU-768170TU
    TU-872 SLK Sp170TU
    TU-883170TU
    IT-180ATC175ITEQ
    KB-6167F170KB
    M6185
    Kappa 438280Rogers
    RO4350B280Rogers
    RO4003C280Rogers
    RO4730G3280Rogers
    RO4360G2280Rogers


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