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Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

    Buy cheap Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm from wholesalers
     
    Buy cheap Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm from wholesalers
    • Buy cheap Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm from wholesalers
    • Buy cheap Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm from wholesalers
    • Buy cheap Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm from wholesalers
    • Buy cheap Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm from wholesalers
    • Buy cheap Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm from wholesalers

    Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm

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    Brand Name : Bicheng
    Model Number : BIC-506.V1.0
    Certification : UL, ISO9001, IATF16949
    Price :
    Payment Terms : T/T
    Supply Ability : 5000PCS per month
    Delivery Time : 8-9 working days
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    Multi Layer FR4 PCB Board High Tg Lead Free 400mmX500mm


    High Tg Multi-layer Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS Lead Free Compliance

    (Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)


    General Description

    IT-180ATC is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with high thermal reliability and CAF resistance. It’s suitable for various applications and can pass 260℃ lead free assembly. Thickness ranges 0.5mm to 3.2mm, copper weight 0.5oz to 3oz.


    Applications

    -Automotive (Engine room ECU)

    -Multilayer and HDI PCB

    -Backplanes

    -Data Storage

    -Server and Networking

    -Telecommunications

    -Heavy Copper



    Key Features

    -Low CTE

    -High heat resistance

    -Excellent CAF resistance

    -Good through-hole reliability


    Our PCB Capability (IT-180ATC)

    PCB Material:High Tg, Lead Free High Reliability Epoxy Resin
    Designation:IT-180ATC
    Dielectric constant:4.4 at 1GHz
    Layer count:Double Layer, Multilayer, Hybrid PCB
    Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm)
    PCB thickness:0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.4mm, 3.0mm, 3.2mm
    PCB size:≤400mm X 500mm
    Solder mask:Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
    Surface finish:Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
    Technology:HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

    General Properties of IT-180ATC

    ItemsIPC TM-650Typical ValueUnit
    Peel Strength, minimum2.4.8lb/inch
    A. Low profile copper foil5
    B. Standard profile copper foil8
    Volume Resistivity2.5.17.11x109M-cm
    Surface Resistivity2.5.17.11x108M
    Moisture Absorption, maximum2.6.2.10.1%
    Permittivity (Dk, 50% resin content)--
    A. 1MHz2.5.5.94.5
    B. 1GHz2.5.5.94.4
    Loss Tangent (Df, 50% resin content)--
    A. 1MHz2.5.5.90.014
    B. 1GHz2.5.5.90.015
    Flexural Strength, minimumN/mm2
    A. Length direction2.4.4500-530
    B. Cross direction410-440
    Thermal Stress 10 s at 288°C
    A. Unetched2.4.13.1PassRating
    B. EtchedPass
    FlammabilityUL94V-0Rating
    Comparative Tracking Index (CTI)IEC 60112 / UL 746CTI 3 (175-249)Class (Volts)
    Glass Transition Temperature(DSC)2.4.25175˚C
    Decomposition Temperature2.4.24.6345˚C
    X/Y Axis CTE (40℃ to 125℃)2.4.4111-13 / 13-15ppm/˚C
    Z-Axis CTE
    A. Alpha 145ppm/˚C
    B. Alpha 22.4.24210ppm/˚C
    C. 50 to 260 Degrees C2.7%
    Thermal Resistance
    A. T2602.4.24.1>60Minutes
    B. T28820Minutes


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