CuW Tungsten Copper Alloy Electronic Packaging Materials And Heat Sink

Tungsten Copper Alloy Electronic Packaging Materials And Heat Sink

The Tungsten Copper Alloy Electronic Packaging Materials And Heat Sink material is a composite material of tungsten and copper. It has both the low expansion characteristics of tungsten and the high thermal conductivity of copper. The thermal expansion coefficient and thermal conductivity of tungsten and copper can be adjusted with the composition of W-Cu. The material can also be processed into various shapes

Tungsten Copper Alloy Electronic Packaging Materials And Heat Sink Picture:

The difference between tungsten copper alloy and molybdenum copper alloy?
Also as alloy materials, tungsten-copper alloy and molybdenum-copper alloy are used in a wide range of applications, such as aerospace, aviation, navigation, military, defense, electronics, electric power, metallurgy, machinery, sports equipment and other industries. In the same application field, although they can be replaced with each other in some cases, there are many differences.

1. Different definitions
Tungsten copper alloy is an alloy material composed of tungsten atoms and copper atoms. The English name is copper tungsten or tungsten copper. The copper content is 10%-50%, and the tungsten content is 30%-95%.
Molybdenum-copper alloy is an alloy material composed of molybdenum atoms and copper atoms. It is called molybdenum-copper alloy in English. It can replace the application of tungsten-copper alloy in many cases. According to the different chemical composition, the grades of molybdenum copper alloy can be divided into MoCu10, MoCu15, MoCu20, MoCu25, MoCu40, and their total impurity content is less than 0.1%.

2. Different in nature
Tungsten copper alloy has both the characteristics of tungsten and copper, and has good electrical and thermal conductivity, corrosion resistance, wear resistance and processing performance. When the temperature is above 3000 ℃, the copper in the alloy will be liquefied and evaporated. Compared with tungsten copper, molybdenum copper has lower density and lighter weight, and is more suitable for use in some products with stricter requirements on weight indicators.
Molybdenum copper alloy has the characteristics of both molybdenum and copper, and has the characteristics of non-magnetic, strong high temperature resistance, high thermal conductivity, low adjustable thermal expansion coefficient, excellent vacuum performance and mechanical processability. In terms of heat resistance and wetting, molybdenum copper is worse than tungsten copper.

Three, the production process is different
The preparation methods of tungsten copper alloy include powder metallurgy method, injection molding method, copper oxide powder method, tungsten skeleton infiltration method and so on. Among them, the powder metallurgy process to prepare tungsten copper alloy is powder-making-batching mixing-pressing forming-sintering infiltration-cold working.
The preparation methods of molybdenum copper alloy include liquid phase sintering method and molybdenum skeleton infiltration method. The liquid phase sintering method refers to the liquid phase sintering of the molybdenum-copper mixed powder at a temperature of 1300-1500°C after being pressed into a shape.

Four, different uses
Tungsten copper alloy is mainly used in high temperature resistant materials, electrical machining electrodes, microelectronic materials, electrical alloys for high voltage switches, etc.
Molybdenum copper alloy is suitable for manufacturing military and civilian high-power microelectronic devices.

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