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8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board

    Buy cheap 8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board from wholesalers
     
    Buy cheap 8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board from wholesalers
    • Buy cheap 8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board from wholesalers
    • Buy cheap 8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board from wholesalers

    8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCEH
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
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    8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board

    8 Layer TG130 High TG PCB LED Copper Based Metal Core Circuit Board


    Specification:

    Size: 5*3 cmBoard THK: 1.2MM
    Copper THK: 1OZOrigin: China
    Model: XCEHBrand: XCE



    Description:

    Tg is Glass Transition Temperature. As flammability of board is V-0 (UL 94-V0), so if the temperature exceeds designated
    tg value, the board will changed from glassy state to rubbery state and then the function of board will be affected.
    High TG materials have better mechanical strength, dimension stability, adhesiveness, moisture absorption, thermal decomposition,
    and thermal expansion than normal TG pcbs.
    High Tg material (TG170) is also popular in LED lighitng industry, because heat dissipation of LED is higher than normal electronic
    components, however same structure of FR4 board is much cheaper than that of metral core pcbs, like aluminum board.

    Parameter:

     

    High precision prototype

    PCB bulk production

    Max Layers

    1-28 layers

    1-14 layers

    MIN Line width(mil)

    3mil

    4mil

    MIN Line space(mil)

    3mil

    4mil

    Min via (mechanical drilling)

    Board thickness≤1.2mm

    0.15mm

    0.2mm

    Board thickness≤2.5mm

    0.2mm

    0.3mm

    Board thickness>2.5mm

    Aspect Ration≤13:1

    Aspect Ration≤13:1

    Aspect Ration

    Aspect Ration≤13:1

    Aspect Ration≤13:1

    Board thickness

    MAX

    8mm

    7mm

    MIN

    2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm

    2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm

    MAX Board size

    610*1200mm

    610*1200mm

    Max copper thickness

    0.5-6oz

    0.5-6oz

    Immersion Gold/
    Gold Plated Thickness

    Immersion Gold:Au,1—8u”
    Gold finger:Au,1—150u”
    Gold Plated:Au,1—150u”
    Nickel Plated :50—500u”

     

    Hole copper thick

    25um 1mil

    25um 1mil

    Tolerance

    Board thickness

    Board thickness≤1.0mm:+/-0.1mm
    1.0mm<Board thickness≤2.0mm:+/-10%
    Board thickness>2.0mm:+/-8%

    Board thickness≤1.0mm:+/-0.1mm
    1.0mm<Board thickness≤2.0mm:+/-10%
    Board thickness>2.0mm:+/-8%

    Outline Tolerance

    ≤100mm:+/-0.1mm
    100< ≤300mm:+/-0.15mm
    >300mm:+/-0.2mm

    ≤100mm:+/-0.13mm
    100< ≤300mm:+/-0.15mm
    >300mm:+/-0.2mm

    Impedance

    ±10%

    ±10%

    MIN Solder mask bridge

     0.08mm

     0.10mm

    Plugging Vias capability

     0.25mm--0.60mm

     0.70mm--1.00mm
































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