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OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

    Buy cheap OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway from wholesalers
     
    Buy cheap OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway from wholesalers
    • Buy cheap OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway from wholesalers
    • Buy cheap OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway from wholesalers

    OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

    Ask Lasest Price
    Brand Name : HNL-PCBA
    Model Number : PCBA-01
    Certification : ISO9001,IS16949, ISO14001,ROHS ,IPC-A ,QC080000
    Price : Negotiable
    Payment Terms : T/T, Western Union, L/C, MoneyGram
    Supply Ability : 10,000,000 Point /Day
    Delivery Time : 1-7days
    • Product Details
    • Company Profile

    OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway

    OSP 6 Layer 3 Mil Printed Circuit SMT Board Assembly For High Speed Railway


    Printed Circuit SMT Board Assembly Introduction

    Haina lean Electronics is a one-stop EMS supplier integrating PCB design, PCB manufacturing, Component sourcing and PCB assembly.
    The company is specialized in electronic products supporting processing services, mainly to undertake circuit board design, layout production, components procurement, PCB plate making, circuit board welding assembly debugging and other OEM/ODM services.


    Our engineers is qualified and experienced in producing surface-mount (SMT), through-hole (THT) and mixed-technology components and fine-pitch parts and ball grid arrays (BGAs) for high-density FR-4 PCBs .


    PCB CAPABILITIES

    No.Items
    1HDI CapabilitiesHDI ELIC(5+2+5)
    2Max layer count36L
    3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness0.3-3.5mm
    4Min.Hole SizeLaser 0.05mm
    Mechnical 0.15
    5Min Line Width/Space0.030mm/0.030mm
    6Copper Thickness1/3oz-6oz
    7Size Max Panel size700x610mm
    8Registration Accuracy+/-0.05mm
    9Routing Accuracy+/-0.05mm
    10Min.BGA PAD0.125mm
    11Max Aspect Ratio10:01
    12Bow and Twist0.50%
    13Impedance Control Tolerance+/-5%
    14Daily output4,000m2 (Max capacity of equipment)
    15Surface FinishingENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
    16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

    PCBA CAPABILITIES


    PCBA Capability
    Material TypeItemMinMax
    PCBDimension (length,width,height.mm)50*40*0.38600*400*4.2
    MaterialFR-4,CEM-1,CEM-3,Aluminium-based board,Rogers,ceramic plate,FPC
    Surface finishHASL,OSP,Immersion gold,Flash Gold Finger
    ComponentsChip&IC100555mm
    BGA Pitch0.3mm-
    QFP Pitch0.3mm-

    Our advantage

    Service value

    Independent quotation system to quickly serve the market

    PCB manufacturing

    High-tech PCB and PCB assembly production line

    Material purchasing

    A team of experienced electronic component procurement engineers

    SMT post soldering

    Dust-free workshop, high-end SMT patch processing



    Delivery Time


    Product TypeQtyNormal lead timeQuick-turn lead time
    SMT+DIP1-501WD-2WD8H
    SMT+DIP51-2002WD-3WD1.5WD
    SMT+DIP201-20003WD-4WD2WD
    SMT+DIP≥20014WD-5WD3WD
    PCBA(2-4Layer)1-502.5WD-3.5WD1WD
    PCBA(2-4Layer)51-20005WD-6WD2.5WD
    PCBA(2-4Layer)≥2001≥7WD5WD
    PCBA(6-10Layer)1-503WD-4WD2.5WD
    PCBA(6-10Layer)51-20007WD-8WD6WD
    PCBA(10-HDILayer)1-507WD-9WD5WD
    PCBA(10-HDILayer)51-20009WD-11WD7WD

    Printed Circuit SMT Board Assembly Application Field


    Assembled Printed Circuit Boards are mainly used for many communication industry, medical equipments, consumer electronics and automobile industry ,automotive electronics , audio and video, optoelectronics, robotics, hydroelectric power, aerospace, education, power supply, printer etc industries.



    Workshop



    Partners



    Common packaging


    PCB: Vacuum packaging with carton box
    PCBA: ESD packaging with carton box



    Quality OSP 6 Layer 3 Mil SMD PCB Assembly For High Speed Railway for sale
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