New High-Performance PCB Released
A new printed circuit board (PCB) designed for demanding
applications has been launched by our company. This 2-layer PCB
features a RO4534 hydrocarbon ceramic/woven glass laminate
manufactured with a dielectric constant of 3.4. The material's
excellent thermal conductivity and wide -40°C to +85°C operating
temperature range make it suitable for rugged environments.
The PCB has been constructed with a stackup of 35um finished copper
on both sides of a 60 mil (1.524mm) RO4534 core. With 1 oz finished
copper weight, optimal current-carrying capacity and heat
dissipation are provided by the board.
Key construction characteristics include:
- Board dimensions of 170.66mm x 70.33mm were used
- A minimum trace/space of 4/4 mils was implemented
- A 0.4mm minimum hole size was utilized
- The thickness was made to be 1.6mm
- 1 mil via plating was incorporated
- An immersion gold surface finish was applied
- 100% electrical testing was completed
The PCB design has had several high-reliability features included
such as lead-free fabrication processes, resin-filled vias, and
solder masks on both sides. It has been fabricated to meet IPC
Class 2 standards for optimal quality.
With 173 components, 200 total pads, and 161 vias packed into a
compact footprint, complex circuit designs are enabled by this PCB.
Exceptional thermal transfer and structural integrity are provided
by the resin-filled vias.
This advanced PCB has undergone design, fabrication, and testing to
deliver reliable performance in demanding applications. Its
high-end materials and robust design parameters make it an ideal
choice for use in aerospace, defense, industrial, and other rugged
operating environments.
Any additional technical information on this new PCB product can be
obtained by contacting Sally Mao at sales30@bichengpcb.com. We look
forward to this board being supplied for your most challenging
circuit applications.
