Hello everyone,
Today, we talk about TLF-35 high frequency PCB.
Taconic TLF-35 is an organic-ceramic laminates which is based on
woven glass reinforcement. It is a result of both ceramic fill
technology and coated PTFE fiberglass.
We benefit from its following advantages:
1. Improved phase intermodulation distortion (PIMD) with DK3.5
TLF-35 is designed to obtain improved PIMD performances on size
effective PCBs for antenna application. The dielectric constant of
TLF-35 is 3.5 which is similar with PIMD required levels.
2. Improved PTH quality
It shows better PTH quality which results in more stable hole wall
and insulation resistance even for the smaller drilled holes.
3. Stable at high frequency
TLF-35 is designed to offer superior high frequency performance.
4. Low moisture absorption
Its ultra-low moisture absorption rate and low dissipation factor
minimize phase shift with frequency.
5. Cost.
Low cost realizes high volume commercial microwave and radio
frequency application.
Typical applications are shown as follows.
1. Antenna
2. Power amplifiers (TD-SCDMA, WCDMAS, LTE, WLAN etc.)
3. LNA, Repeater PA
4. Passive RF components (Filters, Couplers etc.)
PCB Capability (TLF-35)
| PCB Material: | Organic-ceramic Laminates |
| Designation: | TLF-35 |
| Dielectric constant | 3.50 ±0.05 |
| Layer count: | 1 Layer, 2 Layer, 4 Layer. |
| Copper weight: | 0.5oz, 1oz, 2oz |
| PCB thickness: | 0.8mm, 1.6mm |
| PCB Size: | ≤400mm X 500mm |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin etc. |
| | |
We’re able to supply TLF-35 high frequency PCB with 1oz and 2oz
copper, 0.8mm and 1.6mm thick, maximum panel size 400 X 500mm, with
surface finish bare copper, HASL, ENIG, immersion tin etc.
Bicheng specializes in providing you with prototype, small batches
and mass production service. If you have any questions, please feel
free to contact us.
Thank you for your reading.
Appendix: Typical Value of TLF-35
| Property | Test Method | Units | Value | Units | Value |
| Dielectric Constant at 1.9GHz | IPC-TM 650 2.5.5.5.1 Mod | | 3.50±0.05 | | 3.50±0.05 |
| Dissipation Factor at 1.9GHz | IPC-TM 650 2.5.5.5.1 Mod | | 0.0016 | | 0.0016 |
| Dissipation Factor at 10GHz | IPC-TM 650 2.5.5.5.1 Mod | | 0.0022 | | 0.0022 |
| Water absorption | IPC-TM 650 2.6.2.1 | % | 0.03 | % | 0.03 |
| Peel Strength(1oz copper) | IPC-TM 650 2.4.8 | Lbs./linear inch | 10 | M/mm | 1.8 |
| Volume Resistivity | IPC-TM 650 2.5.17.1 | Mohm.cm | 2.0 x 109 | Mohm.cm | 2.0 x 109 |
| Surface Resistivity | IPC-TM 650 2.5.17.1 | Mohm | 3.0 x 108 | Mohm | 3.0 x 108 |
| Flexural Strength Lengthwise | IPC-TM 650 2.4.4 | psi | 13,000 | M/mm2 | 90 |
| Flexural Strength Crosswise | IPC-TM 650 2.4.4 | psi | 13,000 | M/mm2 | 90 |
| Thermal Conductivity | IPC-TM 650 2.4.50 | W/m/K | 0.37 | W/m/K | 0.37 |
| x-y CTE(50-150℃) | IPC-TM 650 2.4.41 | ppm/℃ | 9-12 | ppm/℃ | 9-12 |
| z CTE(50-150℃) | IPC-TM 650 2.4.41 | ppm/℃ | 80 | ppm/℃ | 80 |
| Flammability | UL-94 | | V-0 | | V-0 |
