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Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4

    Buy cheap Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4 from wholesalers
     
    Buy cheap Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4 from wholesalers
    • Buy cheap Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4 from wholesalers
    • Buy cheap Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4 from wholesalers
    • Buy cheap Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4 from wholesalers

    Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4

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    Brand Name : Bicheng Technologies Limited
    Model Number : BIC-0083-V3.1
    Certification : UL
    Price : USD 2.88-6.99 per piece
    Payment Terms : T/T, Paypal
    Supply Ability : 45000 pieces per month
    Delivery Time : 4-5 working days
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    Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4

    Hybrid High Frequency Multilayer PCB 6-Layer Hybrid PCB Made On 12mil 0.305mm RO4003C and FR-4

    (Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)


    Hello everyone,

    Warm greetings!

    Today we’re introducing a type of 6-layer RF PCB built on 12mil RO4003C and FR-4. This board is used for satellite antenna. Following drawing is the stack-up of the board.



    Viewing from the stack-up, the 12mil core is on the top layer and it mainly plays the roles of signal layer. The core has fixed thickness which is very important to the electrical length of RF lines on the circuit board. The rest layers are FR-4 epoxy glass material with similar thickness with RO4003C.


    The detailed specifications are as follows.

    Base material: 12mil 0.305mm RO4003C+ Tg170 FR-4

    Dielectric constant: 3.38+/-0.05

    Layer count: 6 layers

    Via type: Through holes

    Format: 105mm x 80mm = 1 type = 1 piece

    Surface finish: Immersion gold

    Copper weight: Outer layer 35μm / Inner layer 18μm

    Solder mask / Legend: Green / White

    Final PCB height: 1.4 mm

    Others: Impedance controlled PCB

    Standard: IPC 6012 Class 2

    Packing: 20 panels are packed for shipment.

    Lead time: 10 working days

    Shelf life: 6 months



    At present, the mature mixed pressing materials are as follows:

    RO4350B + FR4;

    RO4003C + FR4;

    F4B + FR4;

    RT/duroid 5880 + RO4350B

    RT/duroid 5880 + FR4


    Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.


    Our PCB Capability 2022

    ParameterValue
     Layer Counts 1-32
     Substrate MaterialRO4350B, RO4003C, RO4730G3, RO4360G2, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM4, TMM10, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
     Maximum Size Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
     Board Outline Tolerance ±0.0059" (0.15mm)
     PCB Thickness0.0157" - 0.3937" (0.40mm--10.00mm)
    Thickness Tolerance(T≥0.8mm) ±8%
    Thickness Tolerance(t<0.8mm) ±10%
     Insulation Layer Thickness0.00295" - 0.1969" (0.075mm--5.00mm)
     Minimum Track0.003" (0.075mm)
     Minimum Space 0.003" (0.075mm)
     Outer Copper Thickness 35µm--420µm (1oz-12oz)
     Inner Copper Thickness 17µm--350µm (0.5oz - 10oz)
     Drill Hole(Mechanical)0.0059" - 0.25" (0.15mm--6.35mm)
     Finished Hole(Mechanical)0.0039"-0.248" (0.10mm--6.30mm)
    DiameterTolerance(Mechanical)0.00295" (0.075mm)
     Registration (Mechanical)0.00197" (0.05mm)
     Aspect Ratio 12:1
     Solder Mask Type LPI
     Min Soldermask Bridge0.00315" (0.08mm)
     Min Soldermask Clearance0.00197" (0.05mm)
     Plug via Diameter0.0098" - 0.0236" (0.25mm--0.60mm)
    Impedance Control Tolerance ±10%
     Surface FinishHASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

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