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30L FR4 SMT PCB Assembly 7.0mm Thickness Lead Free HASL 94v0 Standard

    Buy cheap 30L FR4 SMT PCB Assembly 7.0mm Thickness Lead Free HASL 94v0 Standard from wholesalers
     
    Buy cheap 30L FR4 SMT PCB Assembly 7.0mm Thickness Lead Free HASL 94v0 Standard from wholesalers
    • Buy cheap 30L FR4 SMT PCB Assembly 7.0mm Thickness Lead Free HASL 94v0 Standard from wholesalers
    • Buy cheap 30L FR4 SMT PCB Assembly 7.0mm Thickness Lead Free HASL 94v0 Standard from wholesalers

    30L FR4 SMT PCB Assembly 7.0mm Thickness Lead Free HASL 94v0 Standard

    Ask Lasest Price
    Brand Name : KAZ
    Model Number : KAZA-100
    Certification : UL&ROHS
    Payment Terms : T/T, Western Union, MoneyGram, L/C, D/A
    Supply Ability : 2000 m2 / Month
    Delivery Time : 3-14 days
    • Product Details
    • Company Profile

    30L FR4 SMT PCB Assembly 7.0mm Thickness Lead Free HASL 94v0 Standard

    Ultrafast PCB fabrication manufacturer, offering one-stop PCB manufacturing, PCB assembly, SMT stencil,cheap and good quality pcb smt assembly


    1. Features


    1. One Stop OEM Service, PCB manufacturing Made in Shenzhen of China

    2. Manufactured by Gerber File and BOM List from Customer

    3. FR4 Material, Meet 94V0 standard

    4. SMT, DIP technology suport

    5. Lead Free HASL, Environmental Protection

    6. UL, CE, ROHS Compliant

    7. Shipping By DHL,UPS, TNT, EMS or Customer requirement


    2. PCB Technical capability


    SMTPosition accuracy:20 um
    Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP
    Max. component height::25mm
    Max. PCB size:680×500mm
    Min. PCB size:no limited
    PCB thickness:0.3 to 6mm
    PCB weight:3KG
    Wave-SolderMax. PCB width:450mm
    Min. PCB width: no limited
    Component height:Top 120mm/Bot 15mm
    Sweat-SolderMetal type :part, whole, inlay, sidestep
    Metal material:Copper , Aluminum
    Surface Finish:plating Au, plating sliver , plating Sn
    Air bladder rate:less than20%
    Press-fitPress range:0-50KN
    Max. PCB size:800X600mm
    TestingICT,Probe flying,burn-in,function test,temperature cycling

    3.PCB Manufacturing Process


    1. 1.1 Step 1 – The Design.
    2. 1.2 Step 2 – Printing the Design.
    3. 1.3 Step 3 – Creating the Substrate.
    4. 1.4 Step 4 – Printing the Inner Layers.
    5. 1.5 Step 5 – Ultraviolet Light.
    6. 1.6 Step 6 – Removing Unwanted Copper.
    7. 1.7 Step 7 – Inspection.
    8. 1.8 Step 8 – Laminating the Layers.

    4.The PCB Fabrication Process


    • Imaging desired layout on copper clad laminates
    • Etching or removing excess copper from inner layers to reveal traces and pads
    • Creating the PCB layer stackup by laminating (heating and pressing) board materials at high temperatures
    • Drilling holes for mounting holes, through hole pins and vias
    • Etching or removing excess copper from the surface layer(s) to reveal traces and pads
    • Plating pin holes and via holes
    • Adding protective coating to surface or solder masking
    • Silkscreen printing reference and polarity indicators, logos or other markings on the surface
    • Optionally, a finish may be added to copper areas of surface

    5.PCB Pictures




    Quality 30L FR4 SMT PCB Assembly 7.0mm Thickness Lead Free HASL 94v0 Standard for sale
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