2-inch Waffle Pack IC Chip Tray
Custom cavity waffle packs tailored to your chip size, thickness,
and handling method—ideal for high-value devices.
High temperature tray is an IC tray, an IC tray is a semiconductor
chip enterprise for its chips for packaging and baking test
carrier. Because it can be used in a 120℃-220℃bake environment
without deformation characteristics, the electronic waste industry
commonly known as "high temperature plate"
Antistatic plastic trays can eliminate static electricity, a large
number of electronic devices and products in the production process
of turnover loading, packaging, storage, and transportation. The
finished product has good mechanical strength and heat resistance,
Good impact resistance, and chemical corrosion resistance. It will
not change its anti-static performance due to the environment,
time, and temperature. It is mainly used in the electronics
industry.
Advantages:
1. Lightweight, saving transportation and packaging costs;
2. Size specification, compatible with any 2 ", 3 ", or 4" Waffle
Pack Feeder Machine;
3. Good anti-static performance, effectively ensures that the
product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature
automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production
conditions of products;
6. Matrix arrangement design, under the premise of protecting the
product, the most dozen capacity design, cost saving;
7. Edge chamfer design effectively prevents stacking error, and
corrects the direction of placement.
Technical Parameters:
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | TBC | Customizable |
| Provide professional design and packaging for your products |
| Brand | Hiner-pack | Outline Line Size | 50.7*50.7*4mm |
| Model | HN2078 | Cavity Size | 4.83*3.94*0.65 mm |
| Package Type | Die | Matrix QTY | 10*8=80PCS |
| Material | PC | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Application:
Semiconductor Wafer Die Wafer Bare, Electronic components, optical
electronic components, etc.
FAQ:
Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design
capabilities, in the mass production of all kinds of IC trays also
have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase
quantity of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged
according to different product value, and all samples shipping
costs are normally is by collected or as agreed.
Q: What kind of Incoterms can you do?
A: We could support Ex works, FOB, CNF, CIF, CFR, DDU, DAP, etc.,
and other incoterms as agreed.
Q: What method can you help ship the goods?
A: By sea, by air, or by express, by mail, post, according to
customer order quantity and volume.
