Carrying JEDEC IC Trays ESD Durable PPE SGS Approved
ESD Durable PPE JEDEC Trays Can Be Customized Different Colors For
Carrying IC
JEDEC tray is more and more widely used in the semiconductor
industry. It can carry IC chips of different packaging methods and
modules of various sizes. It provides convenient and safe
transportation guarantee for high-precision components.
The design of the structure and shape in line with JEDEC
international standards can also perfectly meet the requirements of
the carriing components or IC of the tray, carriing function to
meet the requirements of the automatic feeding system, to achieve
the modernization of loading, improve work efficiency.
1. Designs conforms JEDEC international standard, and has strong
versatility.
2. Optimal product design,can provide a variety of packaging IC with
protection and while reducing transportation costs.
3. V type tray designs, with added protection for IC substrate edge
ball placement.
4. A variety of materials for customers to choose from to meet your
ESD and process requirements.
5. Support for non- standard format customization.
6. BGA,QFN,QFP,PGA,TQFP,LQFP, SoC SiP etc. All packaging methods are
available. Can be customized based on customers requirement(e.g:
ESD property, Baking Temp,Baking Time).
JEDEC standard matrix trays or jusut JEDEC trays for short are a
standard-defined tray used across the entire semiconductor and
microelectronics industry for transporting, handling, and storing
complete chips (integrated circuits) and various other components.
JEDEC trays featured fixed-size slots for placement of chips Trays
are typically made of strong inflexible plastic.
The Flat cells in the center area of each tray is designed for
automatic equipment to allow the use of vacuum picking up tools. If
it is necessary to cancel in special cases, we can also change the
design according to your requirements at the beginning of the
design.
The tray has a 45-degree chamfer to provide the visual indicator of
Pin 1 orientation of the IC and prevent the stack of errors, reduce
the possibility of workers making mistakes and maximize the
protection of the chip.
| Material | Bake Temperature | Surface Resistance |
| PPE | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Carbon Powder | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| MPPO+Glass Fiber | Bake 125°C~Max 150°C | 1.0*10E4Ω~1.0*10E11Ω |
| PEI+Carbon Fiber | Max 180°C | 1.0*10E4Ω~1.0*10E11Ω |
| IDP Color | 85°C | 1.0*10E6Ω~1.0*10E10Ω |
| Color, temperature and other special requirements can be customized |
FAQ
1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as
possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us
with Skype / Email / Phone / Whatsapp, in case of any delays.
2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.
3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear
description of the IC or component.Provide one-stop service from
design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one
which is the most convenient or cost effective for you.
5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products
comply with the international JEDEC standards, to ensure 100%
qualified rate.
