Through Hole Structure IC Packaging Tray Lightweight Moisture Proof
Through Hole Structure Plastic ESD Trays For Loading Electronic
Components
Our company has skillful and well-trained team in the field of
Semiconductor packaging design to work out customer's
requirements,for instance,different temperature,color,ESD property
and cleanliness class etc.Experienced product structure engineering
team can design various of IC chip,wafer,precision components
packaging methods and specifications and other special demands to
fit you well.
The anti-static tray is made of special high-temperature resistant
plastic by injection molding process, and the resistance value of
the material surface is according to international standard.
The Key Differences Between ESD and Anti-Static.
Anti-static have a coating or chemical additive that dissipates
static across its surface so you never build up enough charge to
get a shock. ESD is a much more robust solution that delivers
greater long-term results because it is actually earthed.
Advantages
1. Light weight, saving transportation and packaging costs;
2. Edge chamfer design, effectively prevent stacking error, correct
the direction of placement
3. Good anti-static performance, effectively ensure that the
product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature
automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production
conditions of products;
6. Matrix arrangement design, under the premise of protecting the
product, the most dozen capacity design, cost saving;
Application
Semiconductor Wafer Die Wafer Bare, Electronic components, optical
electronic components, etc
Character Reference
1. Material:ESD PC injection molding
2. Properties:release goods surface of goods static charge,so the
goods will not produce charge accumulation and high potential
difference.
3. Strong, moisture-proof and preservative
4. Use:cycle loading ,packaging storage and transportation in
producing processing and electronic devices.
Outline Line Size | 129.5*135*15.3mm | Brand | Hiner-pack |
Model | HN21033 | Package Type | IC |
Cavity Size | 6.88*12.08*5.9mm | Matrix QTY | 7*7=49PCS |
Material | PC | Flatness | MAX 0.4mm |
Color | Black | Service | Accept OEM,ODM |
Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
FAQ
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years
with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you
according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we
can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee
should be paid by yourself.
Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly
please.
Q7: When can we get the samples?
We can send you them right now if you are interested in something
we have stock, and customize
the project depending on the specific time.
