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ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

    Buy cheap ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover from wholesalers
     
    Buy cheap ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover from wholesalers
    • Buy cheap ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover from wholesalers
    • Buy cheap ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover from wholesalers
    • Buy cheap ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover from wholesalers
    • Buy cheap ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover from wholesalers

    ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

    Ask Lasest Price
    Brand Name : Hiner-pack
    Model Number : HN2099 Lid
    Certification : ISO 9001 ROHS SGS
    Price : $0.28~0.55
    Payment Terms : T/T
    Supply Ability : 5000PCS~6000PCS per day
    Delivery Time : 5~8 working days
    • Product Details
    • Company Profile

    ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

    ESD 4 Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover

    High Temperature Durable 4 Inch Black Waffle Pack Lids For IC Chip Tray Cover


    The cover and insert materials are generally made of ABS or PC and industry standard anti-static Tyvek paper.

    Manual placement, dislocation, and squeezing of the Tyvek paper are avoided when loading the waffle package

    Seal each individual pallet pocket evenly

    Compensate for normal waffle packaging cover/tray warping conditions, resulting in notching, fixed product elements do not move

    Save a lot of scrap costs caused by yield loss, rework, and mold component movement.

    Advantages:

    1. Suitable for components or devices with daily turnover or long-distance freight;
    2. Can be stacked with more layers;
    3. Can be washed at high temperature;
    4. Plastic waterproof, moisture-proof, improves the storage time of components;
    5. No extrusion and breakage, Better protection components;
    6. Reusable, quality assurance.

    Application:

    Wafer Dicing; Wafer Sorting; Wafer / Die Pick and place; Wafer/ Die Shipping.

    Technical Parameters:

    UsagePackaging of Electronic Components, Optical device
    FeatureESD, Durable, High Temperature, Waterproof, Recycled, Eco-friendly
    MaterialPC, ABS...etc
    ColorBlack.Red.Yellow.Green.White and custom color
    SizeCustomized size, rectangle, circle shape
    Mold typeInjection Mold
    DesignOriginal sample, or we can create the designs
    PackingBy Carton
    SampleSample time: after the draft is confirmed and payment is arranged
    Sample charge: 1. Free for stock samples
    2. Custom Tray negotiated
    Lead Time5-7 Working days
    The exact time should be according to the ordered quantity

    FAQ:

    Q1: Are you a manufacturer?
    A: Yes, we are a 100% manufacturer specializing in packaging for over 12 years with a 1500 square meter workshop area, located in Shenzhen, China.
    Q2: What information should we supply if we want a quotation?
    A: Drawing of your IC or component, Quantity, and size normally.


    Q3: How long could you prepare samples?
    A: Normally, 3 days. If customized, open a new mold 25~30 days around.
    Q4: How about batch order production?
    A: Normally 5- 7 working days or so.
    Q5: Do you inspect the finished products?
    A: Yes, we will inspect according to the ISO 9001 standard and be ruled by our QC staff.

    Quality ESD 4-Inch Black Waffle Tray Packaging Lids High Temperature Resistance Cover for sale
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