ABS MPPO Waffle Pack Bare Die Tray 36 PCS Optical Device Packaging
Our waffle packs meet demanding semiconductor transport
requirements with customizable layout, depth, and cavity count.
To better protect the components or chips, choosing injection trays
for packaging has become an alternative and an option for a
packaging solution. It can not only provide comprehensive
protection for components, but also provide excellent products in
terms of storage and transportation. The great advantage of
convenience. At the same time, due to the reusable characteristics
of plastic pallets, the products we produce can also be reused, and
the waste of plastic after disposal can also be fully degraded,
thereby eliminating some of the problems that need to be dealt with
by environmental protection. Our company can provide one-stop
service from design to production to packaging, solve all the
problems faced by packaging for your parts, choose high-quality
professional suppliers, and reduce unnecessary after-sales troubles
for you.
Waffle Pack (IC Chip Tray), usually used for loading small chips or
components less than 13mm, carrying a large number of chips in a
small volume. At the same time, the purchase of inch products can
match the corresponding accessories such as cover, clip, and Tyvek
paper of the existing series, and the complete package is easier to
transfer, transport, and store the products.
Application:
Wafer Die / Bar / Chips, PCBA module component, component packaging, Optical device packaging.
Advantages:
1. Flexible OEM service: We can produce products according to the
customer’s sample or design.
2. Various Materials: The material can be MPPO, PPE, ABS, PEI, IDP,
etc.
3. Complicated workmanship: tooling making, Injection molding,
Production.
4. Comprehensive customer service: from customer consultation to
after-sales service.
5. 12 years of experience in OEM for USA and EU customers.
6. We have our factory and can control quality at a high level and
produce products quickly and flexibly.
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 101.57*101.57*3mm |
| Model | HN21014-2 | Package Type | IC Parts |
| Cavity Size | 13*13mm | Matrix QTY | 6*6=36PCS |
| Material | ABS | Flatness | MAX 0.3mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM, ODM | TBC | Customizable |
| Provide professional design and packaging for your products |
FAQ:
Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design
capabilities, in the mass production of all kinds of IC trays also
have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase
quantity of orders.
Q: Do you provide samples? Is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged
according to different product value.and all samples shipping cost
normally is by collect or as agreed.
Q: What kind of Incoterms can you do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP
etc. and other incoterm as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, by express, by mail post according to customer
order quantity and volume.
