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FR4 Double Sided Board High Frequency HF PCB Printed Circuit Boards

    Buy cheap FR4 Double Sided Board High Frequency HF PCB Printed Circuit Boards from wholesalers
     
    Buy cheap FR4 Double Sided Board High Frequency HF PCB Printed Circuit Boards from wholesalers
    • Buy cheap FR4 Double Sided Board High Frequency HF PCB Printed Circuit Boards from wholesalers
    • Buy cheap FR4 Double Sided Board High Frequency HF PCB Printed Circuit Boards from wholesalers

    FR4 Double Sided Board High Frequency HF PCB Printed Circuit Boards

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCES
    Certification : CE,ROHS, FCC,ISO9008,SGS,UL
    Price : negotiation
    Payment Terms : T/T,Western union
    Supply Ability : 1, 000, 000 PCS / week
    Delivery Time : 5-10 days
    • Product Details
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    FR4 Double Sided Board High Frequency HF PCB Printed Circuit Boards

    FR4 Double Sided PCB High Frequency HF Boards


    Specification:


    Model:XCEFBoard size:5*6cm
    Board Thickness:1.2MMProfile:V-Cut
    Layer:10Test:flying probe for sample. test jig for mass

    ModelParameterthickness(mm)Permittivity(ER)
    F4BF4B0.382.2
    F4B0.552.23
    F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
    F4Bk0.8,1.52.65
    F4B0.83.5
    FE=F4BM12.2

    Description


    • Aluminum Composites: American Standard Circuits makes PCBs with unique aluminum composite materials to match the coefficient of thermal expansion (CTE) for various heat generating devices. These materials can match the CTE of ceramics, transistor packages and PCBs. This gives greater flexibility in designs to use lightweight materials and meet challenging environmental requirements.
    • Pre-bonded and post-bonded materials
    • Metals include Aluminum, Copper, Brass, Aluminum Composites
    • Thermally and electrically conductive and non-conductive proprietary and commercially available adhesive bonded laminates
    • Plated through hole capability metal carrier to PTFE
    • Single, Double Sided & Multilayer PTFE PCB’s
    • Precision pocket machining
    • Heat Sink Technology
    • Thin dielectric films
    • Any type of wire bondable finishes
    • In-house plating and precision machining for finished assemblies

    Parameter:


    Layer

    1 to 28 layers

    Material type

    FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers

    Board thickness

    0.21mm to 7.0mm

    Copper thickness

    0.5 OZ to 7.0 OZ

    Copper thickness in hole

    >25.0 um (>1mil)


    Size

    Max. Board Size: 23 × 25 (580mm×900mm)

    Min. Drilled Hole Size: 3mil (0.075mm)

    Min. Line Width: 3mil (0.075mm)

    Min. Line Spacing: 3mil (0.075mm)


    Surface finishing

    HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating


    Tolerance


    Shape tolerance: ±0.13

    Hole tolerance: PTH: ±0.076 NPTH: ±0.05

    Certificate

    UL, ISO 9001, ISO 14001

    Special requirements

    Buried and blind vias+controlled impedance +BGA

    Profiling

    Punching, Routing, V-CUT, Beveling

    Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products.



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