unloading can be done during the heat sealing process.
2.High quality heat seal application up to 0.25mm pitch.
3.Pneumatic bonding head provide up to 3,900N force.
4.Digital programmable pressure control with LCD display.
5.Closed loop PID temperature control with visible LED display.
6.Bonding cycle is triggered by a real time pressure sensor.
7.Floating Thermode ensure consistent pressure and heat transfer
along
the flexfoil to LCD and/or PCB.
8.Precision product fixtures (2X), easy exchange, provided with
micrometer
alignment and vacuum to fix components.
9.Optional CCD alignment module with frame, camera, lens, monitor
and
illumination for fine pitch application.
10.Full microprocessor logic control.
Parameters:
Model: CWHP-1A
Size: 500mm X 750mm X 910mm
Work Air Pressure: 0.5-0.7MPA
Working Area: 110mm X 150mm
Temperature setup: 0-400℃
Tolerance of Temp: +2℃
Time of pressing: 0-99s
Tolerance of Pressing: 0.05MPA
Description:
Hot bar soldering is extremely effective in bonding components and
parts
that are dissimilar and difficult to unite. Several examples are
listed above,
but there are many other soldering situations that call hot bar
reflow soldering
system. This technology, also known as pulse bonding, differs from
traditional
soldering since the reflow process uses thermode technology, which
is based
on rapid reflow by pulse heating. This procedure allows materials
with low
temperature resistance to be soldered at high lead-free
temperatures without
damage to the flex. It selectively solders parts by heating them to
a temperature
that's high enough to cause their adhesive or solder to melt and
then re-solidify
to form a permanent bond.
Company info:
Our best service:
1. Engineer overseas tranning for customers.
2. Promise day technical support services.
3. Limit the handling of complaints, half an hour back to
customers.
4. Reliable machine maker,we get Experts--15,each one got over six
years experience,equipment quality will be satisfying.
Our Clients:
