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Audio Amplifier Board Rogers Ro 3010 Pcb With Immersion Tin

    Buy cheap Audio Amplifier Board Rogers Ro 3010 Pcb With Immersion Tin from wholesalers
     
    Buy cheap Audio Amplifier Board Rogers Ro 3010 Pcb With Immersion Tin from wholesalers
    • Buy cheap Audio Amplifier Board Rogers Ro 3010 Pcb With Immersion Tin from wholesalers
    • Buy cheap Audio Amplifier Board Rogers Ro 3010 Pcb With Immersion Tin from wholesalers

    Audio Amplifier Board Rogers Ro 3010 Pcb With Immersion Tin

    Ask Lasest Price
    Brand Name : XCE
    Model Number : XCE BG61
    Certification : CE,ROHS,FCC,ISO9008,SGS,UL
    Price : Negotiation
    Payment Terms : T/T, Western Union
    Supply Ability : 1000000 pieces per week
    Delivery Time : 5-10 working days
    • Product Details
    • Company Profile

    Audio Amplifier Board Rogers Ro 3010 Pcb With Immersion Tin


    High Quality Rogers Ro 3010 Pcb With Immersion Tin Apply for Audio Amplifier Board

    Quick Detail :
    1. Type : Pcb
    2. Material : Rogers
    3. Layer : Multilayer
    4. Products Size :10*8cm
    5. Permittivity : 2.5
    6. Surface finish : Immersion Tin

    Features:
    1. Rogers pcb multilayer pcb with high frequency can improvide the products quality ,with high techolonogy treatment improve the life cycle of the products .
    2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
    3. Multilayer pcb design ,the precision of the pcb improves much more better .
    4. Low dielectric : 2.5 dielectric conductivity much more precision .


    Parameter:


    ModelParameterthickness(mm)Permittivity(ER)
    F4BF4B0.382.2
    F4B0.552.23
    F4B0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.02.65
    F4Bk0.8,1.52.65
    F4B0.83.5
    FE=F4BM12.2
    RogersRO58800.254 0.508 0.7622.20 ± 0.02
    RO43500.254 0.508,0.8,1.5243.5
    RO40030.5083.38
    TACONICTLF-350.83.5
    TLA-60.254,0.8,1,1.5,2.65
    TLX-80.254,0.8,1,1.62.55
    RF-60A0.646.15
    TLY-50.254,0.508,0.82.2
    TLC-320.8,1.5,33.2
    TLA-350.83.2
    ARLONAD255C06099C1.52.55
    MCG0300CG0.83.7
    AD0300C0.83
    AD255C03099C0.82.55
    AD255C04099C12.55
    DLC22012.2


    Description :

    RO3000® Laminates

    RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability.

    RO3000 series laminates are circuit materials with mechanical properties that are consistent regardless of the dielectric constant selected. This allows the designer to develop multi-layer board designs that use different dielectric constant materials for individual layers, without encountering warpage or reliability problems. The dielectric constant versus temperature of RO3000 series materials is very stable.


    High Thermal Performance

    • Tg of 200 (DSC), 230°C (DMA)

    • Low CTE for reliability

    • Lead-free Compatible & Rhos Complaint

    • UV Blocking and AOI Fluorescence

    • Copper Foil Cladding: Grade 3 (HTE),1/2,1 and 2 oz. Foil Options: Reverse treat



    PrePreg Material
    It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

    Key Benefits:

    • High dielectric constant for circuit size reduction
    • Low loss. Ideal for operating at X-band or below
    • Tight εr and thickness control for repeatable circuit performance

    Typical Applications:

    • Automotive radar applications
    • Global positioning satellite antennas
    • Cellular telecommunications systems - power amplifiers and antennas
    • Patch antenna for wireless communications
    • Direct broadcast satellites
    • RFID Tags
    • Surface mount RF components
    • E-Band point to point microwave links

    Production Description :

    ParameterValue
    Specific gravity/density1.850 g/cm3 (3,118 lb/cu yd)
    Water absorption−0.125 in < 0.10%
    Temperature index140 °C (284 °F)
    Thermal conductivity, through-plane0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
    Thermal conductivity, in-plane0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
    Rockwell hardness110 M scale
    Bond strength> 1,000 kg (2,200 lb)
    Flexural strength (A; 0.125 in) - LW> 440 MPa (64,000 psi)
    Flexural strength (A; 0.125 in) - CW> 345 MPa (50,000 psi)
    Tensile strength (0.125 in) LW> 310 MPa (45,000 psi)
    Izod impact strength - LW> 54 J/m (10 ft·lb/in)
    Izod impact strength - CW> 44 J/m (8 ft·lb/in)
    Compressive strength - flatwise> 415 MPa (60,200 psi)
    Dielectric breakdown (A)> 50 kV
    Dielectric breakdown (D48/50)> 50 kV
    Dielectric strength20 MV/m
    Relative permittivity (A)4.8
    Relative permittivity (D24/23)4.8
    Dissipation factor (A)0.017
    Dissipation factor (D24/23)0.018
    Dielectric constant permittivity4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
    Glass transition temperatureCan vary, but is over 120 °C
    Young's modulus - LW3.5×106 psi (24 GPa)
    Young's modulus - CW3.0×106 psi (21 GPa)
    Coefficient of thermal expansion - x-axis1.4×10−5 K−1
    Coefficient of thermal expansion - y-axis1.2×10−5 K−1
    Coefficient of thermal expansion - z-axis7.0×10−5 K−1
    Poisson's ratio - LW0.136
    Poisson's ratio - CW0.118
    LW sound speed3602 m/s
    SW sound speed3369 m/s



    Competitive Advantage:
    1) With UL,ROHS,ISO,IPC
    2).Lead time:3-10 working days
    3)Competitive price best quality
    4).Rich 20 years experience in High Tg Multilayer PCB .


    What Information customer need to provide for quotation ?
    1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
    2. BOM list for PCB assembly.
    3. Send us your sample PCB or PCBA.
    4. OEM is acceptable.



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