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1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers

    Buy cheap 1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers from wholesalers
     
    Buy cheap 1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers from wholesalers
    • Buy cheap 1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers from wholesalers
    • Buy cheap 1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers from wholesalers

    1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers

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    Brand Name : Wenyi Electronics
    Model Number : GPI-Flex-C-007
    Certification : RoHs,SGS,ISO9001:2008
    Price : Negotiable
    Payment Terms : T/T, L/C, D/A, D/P, Western Union, MoneyGram
    Supply Ability : 20000 square meters/ month
    Delivery Time : 12-15 working days afer sample approval
    • Product Details
    • Company Profile

    1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers


    1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers


    Item decription:


    Gold finger 1mm Pitch double side EMI shield FPC flexible printed circuit


    Material: Polymide,


    Cover film: PI cover film


    Type: EMI Shield


    Copper : 1 OZ


    Finger Pitch: 1 mm gold finger


    Stiffener: PI


    Thickness: 0.27mm -0.36mm.


    Business Terms:


    MOQ : 500 pcs/ lot


    Sample lead time: 8-12 working days


    Mass production lead time: 10-14 working days , as per order Qty.


    Our Advantage:


    1. Strong R&D capability
    2. Low cost and competitive price
    3. Stable in quality
    4. EMI Shield anti- interface
    5. Quick delivery
    6. Capable to make 1-8 layers FPC

    Application:


    1. * Household appliances
    2. * Security systems, Bank POS machine payment service system.
    3. * High Precision PCB and High Density PCB
    4. * Various industrial touch panel use
    5. * Membrane Control Panel and device

    Technical specification:


    Monthly output5000 square meters.
    MaterialPolymide, Polyster,
    File formatCAD file(POWERPCB,PROTEL,PADS2000,AUTOCAD,ORCAD, Gerber file
    Solder resist (solder mask)Laminated cover film,Liquid photosensitive prevent weld ink,PI oil film
    Surface treatmentHot Air Solder Leveling,Tinning ,Sink tin ,gold-plating ,Chemistry sink gold ,Anti-oxidation ,Sink copper ,Tin copper
    Finished Thickness0.068-0.6mm
    Max thin wire/spacing2-3mil
    Min Hole Diameter0.2mm
    Max Outline500×350mm
    Mass Production Lead time8-12 working days since order issue


    Quality 1mm Pitch High Density PCB All Flex Flexible Circuits Tin Plated Finger 1-8 Layers for sale
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