Nickel Plated Gold Plated Free Of Surface Defects WCu, MoCu, CMC,
CPC Base Plates Flanges
Descriptions:
Packaging materials strongly effect the effectiveness of an
electronic packaging system regarding reliability, design, and
cost. In electronic systems, packaging materials may serve as
electrical conductors or insulators, create structure and form,
provide thermal paths, and protect the circuits from environmental
factors, such as moisture, contamination, hostile chemicals, and
radiation.
Copper Tungsten, Molybdenum Copper, Cu/Mo/Cu, Cu/MoCu/Cu are
popular refractory metals based heat sink materials offered today.
With the new off-the-shelf system, we are able to offer standard
products with a short lead-time at extremely competitive rates.
By adjusting the content of content, we can have its coefficient of
thermal expansion (CTE) designed to match those of materials such
as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar),
etc.
Advantages:
o High thermal conductivity
o Excellent hermeticity
o Excellent flatness, surface finish, and size control
o Semi-finished or finished (Ni/Au plated) products available
Applications:
Our products are widely used in applications such as
optoelectronics packages, Microwave Packages, C Packages, Laser
Submounts, etc.
