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PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine

    Buy cheap PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine from wholesalers
     
    Buy cheap PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine from wholesalers
    • Buy cheap PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine from wholesalers
    • Buy cheap PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine from wholesalers

    PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine

    Ask Lasest Price
    Brand Name : SMTfly
    Model Number : CWVC-5S
    Certification : CE
    Price : USD
    Supply Ability : 30/Year
    Delivery Time : 30 Working days after payment
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    PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine

    PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine

    1. Description

    Neat and smooth edge, no burr or overflow
    Wide application range, including FPC exterior cutting, profile cutting, drilling, opening window for covering, etc.
    Laser wavelength: 355nm
    Rated power: 10W/12W/15W/18W@30KHz
    Galvanometer working field Per One Process: 40 × 40mm
    Power consumption for the hole machine: 2KW

    2. Features

    More quick and easy, shorten the delivery time;
    High quality ,no distortion,surface clean& uniformity;
    Gathering the CNC tech,laser tech,software tech…High accuracy,High speed;

    3. Cutting Application

    FPC and some relative materials;
    FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting.

    Challenges of Depaneling using Routing/Die Cutting/Dicing Saws

    Damages and fractures to substrates and circuits due to mechanical stress
    Damages to PCB due to accumulated debris
    Constant need for new bits, custom dies, and blades
    Lack of versatility – each new application requires ordering of custom tools, blades, and dies
    Not good for high precision, multi-dimensional or complicated cuts
    Not useful PCB depaneling/singulation smaller boards
    Lasers, on the other hand, are gaining control of the PCB depaneling/singulation market due to higher precision, lower stress on the parts, and higher throughput. Laser depaneling can be applied to a variety of applications with a simple change in settings. There is no bit or blade sharpening, lead time reordering dies and parts, or cracked/broken edges due to torque on the substrate. Application of lasers in PCB depaneling is dynamic and a non-contact process.

    Advantages of Laser PCB depaneling/singulation

    No mechanical stress on substrates or circuits;
    No tooling cost or consumables;
    Versatility – ability to change applications by simply changing settings;
    Fiducial Recognition – more precise and clean cut;
    Optical Recognition before PCB depaneling/singulation process begins;
    Ability to depanel virtually any substrate. (Rogers, FR4, ChemA, Teflon, ceramics, aluminum, brass, copper, etc);
    Extraordinary cut quality holding tolerances as small as < 50 microns;
    No design limitation – ability to cut virtually and size PCB board including complex contours and multidimensional boards.

    PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine Parameters:

    LaserQ-Switched diode-pumped all solid-state UV laser
    Laser Wavelength355nm
    Laser Power10W/12W/15W/17W@30KHz
    Positioning Precision of Worktable of Linear Motor±2μm
    Repetition Precision of Worktable of Linear Motor±1μm
    Effective Working Field460mmX460mm(Customizable)
    Laser Scanning Speed2500mm/s (max)
    Galvanometer Working Field Per One Process

    40mmх40mm


    PCB Depaneling Equipment Laser Depaneling of Flex PCB-FPC Cutting Machine​ Description:

    PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and dicing saw methods. However, as the boards get smaller, thinner, flexible, and more sophisticated, those methods produce even more exaggerated mechanical stress to the parts. Large boards with heavy substrates absorb these stresses better, while these methods used on ever-shrinking and complex boards can result in breakage. This brings lower throughput, along with the added costs of tooling and waste removal associated with mechanical methods.
    Increasingly, flexible circuits are found in the PCB industry, and they also present challenges to the old methods. Delicate systems reside on these boards and non-laser methods struggle to cut them without damaging the sensitive circuitry. A non-contact depaneling method is required and lasers provide a highly precise way of singulation without any risk of harming them, regardless of substrate.



    More information welcome to contact us:

    WhatsApp/Wechat(Bunny): +86 136 8490 4990

    Email:s5@smtfly.com























































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