Saw blade with diamond plated
If you’re searching for the right dicing blades, we recommend our
HT-RE electroformed bond blades. They are a high performance and
high quality wafer saw manufactured using new electroforming
technology. These blades are widely used for dicing semiconductor
wafers, resistance, ceramics, semiconductor encapsulating materials
and more. For more information about these super abrasive dicing
blades and machining tools, please browse the other pages.
Features:
1. The ultra-thin design allows the circular blade to be used for
deep cutting and slotting.
2. The blade thickness ranges from 0.015mm to 0.3mm.
3. Thanks to a combination of multiple specifications of diamond
particles and various bonds, these electroformed dicing blades can
be used for cutting and slotting compound semiconductors, silicon
wafers and ceramic wafers.
Applicable Materials:
Silicon wafer, compound wafer with gallium arsenide, gallium
phosphide, ceramics, lithium niobate, lithium tantalite and more.
Specifications:
**NOTE: The contents in the above picture provide relevant
specifications for the electroformed bond blades. During the
purchasing, please tell us all related factors so we can
communicate and find the right product for you.
Technical Parameters of Electroformed Bond Blades
| O.D | Thickness | I.D |
| Size | Tolerance | Size | Standard tolerance | High precision tolerance | Size | Tolerance |
| 50～ 100 | +0.02 | 0.1~≤ 0.15 | ±0.005 | | 25.4
30
31.75
40
60
80
88.9 | +0.02~ 0 |
| 0.15~≤ 0.25 | ±0.005 | ±0.003 |
| >0.25 | ±0.01 | ±0.005 |
