Custom Size Dicing Saw Blade For Cutting Epoxy Resin Boards BGA
HT-YH Series
The HT-YH hub dicing blade was independently developed by Hongtuo
using international advanced technology. The diamond cutting blade
can effectively prevent different blade, providing customers with a
stable dicing operation. According to a customer’s individual
requirements, we can offer professional designs for these cutting
saw blades. Before designing however, please provide the relevant
parameters about materials, dicing speed, spindle speed, quality
requirements, dicing depth and all other related information.
Features:
1. In comparison to dicing blades with a thickness of less than
60μm, this blade comes with a higher strength and a longer service
life.
2. The ultra-thin cut-off wheel features a great chip removal and
cooling performance.
3. Processed using the electroplated dicing blade with a hub, the
work piece is burr free.
Applications of the Hub Dicing Blade
This particular type of dicing blade is ideally suited for cutting
epoxy resin boards, alloy frame plastic boards, ceramic wafers,
composite plates with a sandwich, BGA and more.
Specifications
