Cutting wheel for semiconductor
Hongtuo, as a major designer, manufacturer and distributor of
diamond and CBN grinding wheels, can offer an excellent selection
of back grinding wheels. This particular grinding tool comes in two
types: a silicon wafer back grinding wheel and an LED substrate
back grinding wheel. Both of them can be used on different grinding
machines made in Europe,America,Japan, and China. They also feature
a stable performance and a high cost effectiveness.
1. Silicon Wafer Back Grinding Wheel
This abrasive wheel is primarily used for thinning and finishing
semiconductor wafers. It comes with a superior grinding performance
and a low coast. It can be used on grinding machines manufactured
in Japan,Germany and China.
Grinding Objects: Discrete devices, IC substrate silicon wafers and
original silicon wafers
Work Piece Materials: Monocrystalline silicon and other
semiconductor materials
Processes: Back to front rough and fine grinding
2. LED Substrate Back Grinding Wheels
This variety of cup grinding wheel is mainly used in the LED
industry for back grinding of sapphire wafers, silicon wafers,
gallium arsenide, and gallium nitride wafers. It works well with
European, American, Japanese and Chinese grinding machines with an
excellent performance and cost effectiveness.
Grinding Objects: Sapphire wafers, silicon wafers, gallium arsenide, and gallium
nitride wafers
Work Piece Materials: Synthetic sapphire, monocrystalline silicon, gallium arsenide and
gallium nitride
